ZHCSCA4B January   2014  – June 2014

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 简化图表
  5. 5 修订历史记录
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  A6 Coil Specification
      2. 8.3.2  EMI Shield
      3. 8.3.3  I2C Interface
      4. 8.3.4  Active or Passive Wake-up State
      5. 8.3.5  Smart Key or Immobilizer Handling
      6. 8.3.6  Option Select Pins
      7. 8.3.7  LED Modes
      8. 8.3.8  Foreign Object Detection (FOD) and Parasitic Metal Object Detect (PMOD) CalibrationForeign Object Detection (FOD) and Parasitic Metal Object Detect (PMOD) Calibration description.
      9. 8.3.9  Shut Down via External Thermal Sensor or Trigger
      10. 8.3.10 Fault Handling and Indication
      11. 8.3.11 Power Transfer Start Signal
      12. 8.3.12 Power-On Reset
      13. 8.3.13 External Reset, RESET Pin
      14. 8.3.14 Trickle Charge and CS100
        1. 8.3.14.1 Over-Current Protection Over-Current Protection description.
      15. 8.3.15 Over-Voltage Protection Over-Voltage Protection section.
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power Transfer
      2. 8.4.2 Communication
      3. 8.4.3 Power Trains
      4. 8.4.4 Signal Processing Components
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Capacitor Selection
        2. 9.2.1.2 Current Monitoring Requirements
        3. 9.2.1.3 All Unused Pins
        4. 9.2.1.4 Input Regulators
        5. 9.2.1.5 Input Power Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Active or Passive Wake-up State
        2. 9.2.2.2 EMI Shield
        3. 9.2.2.3 LED mode
        4. 9.2.2.4 Number of Transmitter Coils
      3. 9.2.3 Application Performance Plots
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 术语表
  13. 13机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Pin Configuration and Functions

RGZ (VQFN) PACKAGE
(TOP VIEW)
po_SLUSBE4.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NUMBER
COIL_PEAK 1 I Input from peak detect circuit
T_SENSE 2 I Sensor input. Device shuts down when below 1 V. If not used, keep above 1 V by simply connecting to 3.3-V supply
Unused 3 I This pin can be either connected to GND or left open. Connecting to GND can improve layout grounding
Unused 4 I This pin can be either connected to GND or left open. Connecting to GND can improve layout grounding
RESET 5 I Device reset. Use 10-kΩ to 100-kΩ pull-up resistor to 3.3-V supply
PMOD 6 O Select for PMOD threshold
LED_A 7 O Connect to a LED via 470-Ω resistor for status indication. Typically GREEN
LED_B 8 O Connect to a LED via 470-Ω resistor for status indication. Typically RED
LED_C 9 O Connect to a LED via 470-Ω resistor for status indication. Typically YELLOW
PMB_CLK 10 I/O 10-kΩ pull-up resistor to 3.3-V supply. I2C Clock
PMB_DATA 11 I/O 10-kΩ pull-up resistor to 3.3-V supply. I2C Data
DPWM_A 12 O PWM Output to half bridge driver. Switching dead times must be externally generated
FOD 13 O Select for FOD threshold
Unused 14 O Reserved, leave this pin open
COIL 1.1 15 O Enables the first coil drive train and COMM signal selector
COIL 1.2 16 O Enables the second coil drive train and COMM signal selector
COIL 1.3 17 O Enables the third coil drive train and COMM signal selector
EN_PWR 18 I/O Enable signal to the front end converter. Select the active or passive wake-up state
RESERVED 19 O Reserved, leave this pin open
RESERVED 20 I Reserved, connect to GND
EMI_SHIELD 21 I Connect to 3.3-V supply to indicate EMI shield is in use. If not, connect this pin to GND
FOD_CAL 22 O FOD Calibration
BUZ_AC 23 O AC buzzer output. A 400-ms, 4-kHz AC pulse train when charging begins
BUZ_DC 24 O DC buzzer output. A 400-ms DC pulse when charging begins. This could also be connected to an LED via 470-Ω resistor
COIL_SEL 25 I Coil type select. Connect to GND for A6 typle Tx
RESERVED 26 I/O Reserved, connect to GND
RESERVED 27 I/O Reserved, leave this pin open
RESERVED 28 I/O Reserved, leave this pin open
RESERVED 29 I/O Reserved, leave this pin open
RESERVED 30 I/O Reserved, leave this pin open
RESERVED 31 I/O Reserved, connect 10-kΩ pull-down resistor to GND. Do not leave open
GND 32 — GND
V33D 33 — Digital Core 3.3-V supply. Be sure to decouple with bypass capacitors as close to the part as possible
V33A 34 — Analog 3.3-V supply. This pin can be derived from V33D supply, decouple with 22-Ω resistor and additional bypass capacitors
BPCAP 35 — Bypass capacitor for internal 1.8-V core regulator. Connect bypass capacitors to GND and to 3.3-V
GND 36 — GND
COMM_A+ 37 I Digital demodulation noninverting input A, connect parallel to input B+
COMM_A- 38 I Digital demodulation inverting input A, connect parallel to input B-
COMM_B+ 39 I Digital demodulation noninverting input B, connect parallel to input A+
COMM_B- 40 I Digital demodulation inverting input B, connect parallel to input A-
RESERVED 41 I Reserved, leave this pin open
I_SENSE 42 I Transmitter input current, used for parasitic loss calculations. Use 40-mΩ sense resistor and A = 50 gain current sense amp
LOSS_THR 43 I Input to program FOD/PMOD thresholds and FOD_CAL correction
LED_MODE 44 I LED Mode Select
V_SENSE 45 I Transmitter power train input voltage, used for FOD and Loss calculations.
Unused 46 I This pin can be either connected to GND or left open. Connecting to GND can improve layout grounding
GND 47 — GND
ADCREF 48 I External reference voltage input. Connect this input to GND.
EPAD 49 — Flood with copper GND plane and stitch vias to PCB internal GND plane