ZHCSEW9B March   2016  – October 2017

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Supply Current
    6. 6.6  Electrical Characteristics: Power Supply Control
    7. 6.7  Electrical Characteristics: AFE Power-On Reset
    8. 6.8  Electrical Characteristics: AFE Watchdog Reset and Wake Timer
    9. 6.9  Electrical Characteristics: Current Wake Comparator
    10. 6.10 Electrical Characteristics: VC1, VC2, VC3, VC4, BAT, PACK
    11. 6.11 Electrical Characteristics: SMBD, SMBC
    12. 6.12 Electrical Characteristics: PRES, BTP_INT, DISP
    13. 6.13 Electrical Characteristics: LEDCNTLA, LEDCNTLB, LEDCNTLC
    14. 6.14 Electrical Characteristics: Coulomb Counter
    15. 6.15 Electrical Characteristics: CC Digital Filter
    16. 6.16 Electrical Characteristics: ADC
    17. 6.17 Electrical Characteristics: ADC Digital Filter
    18. 6.18 Electrical Characteristics: CHG, DSG FET Drive
    19. 6.19 Electrical Characteristics: PCHG FET Drive
    20. 6.20 Electrical Characteristics: FUSE Drive
    21. 6.21 Electrical Characteristics: Internal Temperature Sensor
    22. 6.22 Electrical Characteristics: TS1, TS2, TS3, TS4
    23. 6.23 Electrical Characteristics: PTC, PTCEN
    24. 6.24 Electrical Characteristics: Internal 1.8-V LDO
    25. 6.25 Electrical Characteristics: High-Frequency Oscillator
    26. 6.26 Electrical Characteristics: Low-Frequency Oscillator
    27. 6.27 Electrical Characteristics: Voltage Reference 1
    28. 6.28 Electrical Characteristics: Voltage Reference 2
    29. 6.29 Electrical Characteristics: Instruction Flash
    30. 6.30 Electrical Characteristics: Data Flash
    31. 6.31 Electrical Characteristics: OCD, SCC, SCD1, SCD2 Current Protection Thresholds
    32. 6.32 Timing Requirements: OCD, SCC, SCD1, SCD2 Current Protection Timing
    33. 6.33 Timing Requirements: SMBus
    34. 6.34 Timing Requirements: SMBus XL
    35. 6.35 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Primary (1st Level) Safety Features
      2. 7.3.2  Secondary (2nd Level) Safety Features
      3. 7.3.3  Charge Control Features
      4. 7.3.4  Gas Gauging
      5. 7.3.5  Configuration
        1. 7.3.5.1 Oscillator Function
        2. 7.3.5.2 System Present Operation
        3. 7.3.5.3 Emergency Shutdown
        4. 7.3.5.4 1-Series, 2-Series, 3-Series, or 4-Series Cell Configuration
        5. 7.3.5.5 Cell Balancing
      6. 7.3.6  Battery Parameter Measurements
        1. 7.3.6.1 Charge and Discharge Counting
      7. 7.3.7  Battery Trip Point (BTP)
      8. 7.3.8  Lifetime Data Logging Features
      9. 7.3.9  Authentication
      10. 7.3.10 LED Display
      11. 7.3.11 Voltage
      12. 7.3.12 Current
      13. 7.3.13 Temperature
      14. 7.3.14 Communications
        1. 7.3.14.1 SMBus On and Off State
        2. 7.3.14.2 SBS Commands
    4. 7.4 Device Functional Modes
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 High-Current Path
          1. 8.2.2.1.1 Protection FETs
          2. 8.2.2.1.2 Chemical Fuse
          3. 8.2.2.1.3 Lithium-Ion Cell Connections
          4. 8.2.2.1.4 Sense Resistor
          5. 8.2.2.1.5 ESD Mitigation
        2. 8.2.2.2 Gas Gauge Circuit
          1. 8.2.2.2.1 Coulomb-Counting Interface
          2. 8.2.2.2.2 Power Supply Decoupling and PBI
          3. 8.2.2.2.3 System Present
          4. 8.2.2.2.4 SMBus Communication
          5. 8.2.2.2.5 FUSE Circuitry
        3. 8.2.2.3 Secondary-Current Protection
          1. 8.2.2.3.1 Cell and Battery Inputs
          2. 8.2.2.3.2 External Cell Balancing
          3. 8.2.2.3.3 PACK and FET Control
          4. 8.2.2.3.4 Temperature Output
          5. 8.2.2.3.5 LEDs
          6. 8.2.2.3.6 Safety PTC Thermistor
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Protector FET Bypass and Pack Terminal Bypass Capacitors
      2. 10.1.2 ESD Spark Gap
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 器件和文档支持

11.1 文档支持

11.1.1 相关文档

如需相关文档，请参阅《bq4050 技术参考手册》(SLUUAQ3)。

11.2 社区资源

下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅 TI 的 《使用条款》。

    TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在 e2e.ti.com 中，您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
    设计支持 TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。

11.3 商标

E2E is a trademark of Texas Instruments.

Windows is a registered trademark of Microsoft.

All other trademarks are the property of their respective owners.

11.4 静电放电警告

esds-image

ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.