ZHCSDZ5C August   2014  – November 2014

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Overvoltage-Protection (OVP) - Continuously Monitored
      2. 8.3.2  CHG Pin Indication (bq25101, bq25101H)
      3. 8.3.3  CHG Pin LED Pull-up Source (bq25101, bq25101H)
      4. 8.3.4  IN-DPM (VIN-DPM or IN-DPM)
      5. 8.3.5  OUT
      6. 8.3.6  ISET
      7. 8.3.7  PRE_TERM - Pre-Charge and Termination Programmable Threshold
      8. 8.3.8  TS
      9. 8.3.9  Timers
      10. 8.3.10 Termination
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down or Undervoltage Lockout (UVLO)
      2. 8.4.2 Power-up
      3. 8.4.3 Sleep Mode
      4. 8.4.4 New Charge Cycle
      5. 8.4.5 Termination and Timer Disable Mode (TTDM) - TS Pin High
      6. 8.4.6 Battery Detect Routine
      7. 8.4.7 Refresh Threshold
      8. 8.4.8 Starting a Charge on a Full Battery
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application - Charger Application Design Example
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1 Calculations
          1. 9.2.2.1.1 Program the Fast Charge Current, ISET:
          2. 9.2.2.1.2 Program the Termination Current Threshold, ITERM:
          3. 9.2.2.1.3 TS Function
          4. 9.2.2.1.4 Selecting IN and OUT Pin Capacitors
      3. 9.2.3 bq25100 Application Performance Plots
  10. 10Power Supply Recommendations
    1. 10.1 Leakage Current Effects on Battery Capacity
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Package
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 第三方产品免责声明
    2. 12.2 相关链接
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Pin Configuration and Functions

6-Pin DSBGA
YFP Package
(Top View)
bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L bq25100_PO_lusbv8.gifbq25100/bq25100A/bq25100H/bq25100L



SPACING

6-Pin DSBGA
YFP Package
(Top View)
bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L pinout_lusbv8.gifbq25101/bq25101H

Pin Functions

PIN I/O DESCRIPTION
NAME NUMBER
CHG C1(1) Low (FET on) indicates charging and open drain (FET off) indicates no charging or the first charge cycle complete.
IN A2 I Input power, connected to external DC supply (AC adapter or USB port). Expected range of bypass capacitors 1 μF to 10 μF, connect from IN to VSS.
ISET B2 I Programs the fast-charge current setting. External resistor from ISET to VSS defines fast charge current value. Recommended range is 13.5 kΩ (10 mA) to 0.54 kΩ (250 mA).
OUT A1 O Battery Connection. System Load may be connected. Expected range of bypass capacitors 1 μF to 10 μF.
PRE-TERM C1(1) I Programs the current termination threshold ( 1% to 50% of Iout, 1mA minimum). The pre-charge current is twice the termination current level.
Expected range of programming resistor is 600 Ω to 30 kΩ (6k: Ichg/10 for term; Ichg/5 for precharge)
TS B1 I Temperature sense pin connected to 10k at 25°C NTC thermistor, in the battery pack. Floating TS pin or pulling high puts part in TTDM “Charger” mode and disables TS monitoring, Timers and Termination. Pulling pin low disables the IC. If NTC sensing is not needed, connect this pin to VSS through an external 10-kΩ resistor. A 250-kΩ resistor from TS to ground will prevent IC entering TTDM mode when battery with thermistor is removed.
VSS C2 – Ground pin
(1) Spins have different pin definitions