ZHCSEY2 April   2016

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Overvoltage-Protection (OVP) - Continuously Monitored
      2. 8.3.2  CHG Pin Indication (bq25101, bq25101H)
      3. 8.3.3  CHG Pin LED Pull-up Source (bq25101, bq25101H)
      4. 8.3.4  IN-DPM (VIN-DPM or IN-DPM)
      5. 8.3.5  OUT
      6. 8.3.6  ISET
      7. 8.3.7  PRE_TERM - Pre-Charge and Termination Programmable Threshold
      8. 8.3.8  TS
      9. 8.3.9  Timers
      10. 8.3.10 Termination
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down or Undervoltage Lockout (UVLO)
      2. 8.4.2 Power-up
      3. 8.4.3 Sleep Mode
      4. 8.4.4 New Charge Cycle
      5. 8.4.5 Termination and Timer Disable Mode (TTDM) - TS Pin High
      6. 8.4.6 Battery Detect Routine
      7. 8.4.7 Refresh Threshold
      8. 8.4.8 Starting a Charge on a Full Battery
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1 Calculations
          1. 9.2.2.1.1 Program the Fast Charge Current, ISET:
          2. 9.2.2.1.2 Program the Termination Current Threshold, ITERM:
          3. 9.2.2.1.3 TS Function
          4. 9.2.2.1.4 Selecting IN and OUT Pin Capacitors
      3. 9.2.3 bq25100 Application Performance Plots
  10. 10Power Supply Recommendations
    1. 10.1 Leakage Current Effects on Battery Capacity
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 相关链接
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 器件和文档支持

12.1 器件支持

12.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.2 相关链接

下面的表格列出了快速访问链接。范围包括技术文档、支持与社区资源、工具和软件，以及样片或购买的快速访问。

Table 1. 相关链接

部件 产品文件夹 样片与购买 技术文档 工具与软件 支持与社区
bq25100 请单击此处 请单击此处 请单击此处 请单击此处 请单击此处
bq25101 请单击此处 请单击此处 请单击此处 请单击此处 请单击此处
bq25100A 请单击此处 请单击此处 请单击此处 请单击此处 请单击此处
bq25100H 请单击此处 请单击此处 请单击此处 请单击此处 请单击此处
bq25101H 请单击此处 请单击此处 请单击此处 请单击此处 请单击此处
bq25100L 请单击此处 请单击此处 请单击此处 请单击此处 请单击此处

12.3 商标

Bluetooth is a registered trademark of Bluetooth SIG, Inc..

12.4 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.