ZHCSQP9
March 2023
AMC1306M25E
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Power Ratings
6.6
Insulation Specifications
6.7
Safety-Related Certifications
6.8
Safety Limiting Values
6.9
Electrical Characteristics
6.10
Switching Characteristics
6.11
Timing Diagrams
6.12
Insulation Characteristics Curves
6.13
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Analog Input
7.3.2
Modulator
7.3.3
Isolation Channel Signal Transmission
7.3.4
Digital Output
7.3.4.1
Output Behavior in Case of a Full-Scale Input
7.3.4.2
Output Behavior in Case of Input Common-Mode Overrange
7.3.4.3
Output Behavior in Case of a Missing High-Side Supply
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Shunt Resistor Sizing
8.2.2.2
Input Filter Design
8.2.2.3
Bitstream Filtering
8.2.3
Application Curve
8.3
Best Design Practices
8.4
Power Supply Recommendations
8.5
Layout
8.5.1
Layout Guidelines
8.5.2
Layout Example
9
Device and Documentation Support
9.1
Documentation Support
9.1.1
Related Documentation
9.2
接收文档更新通知
9.3
支持资源
9.4
Trademarks
9.5
静电放电警告
9.6
术语表
10
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
DWV|8
MPDS382B
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsqp9_oa
9.6
术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。