ZHCSIZ2M December   1990  – October 2023 AM26C32 , AM26C32C , AM26C32M

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 ±7-V Common-Mode Range With ±200-mV Sensitivity
      2. 7.3.2 Input Fail-Safe Circuitry
      3. 7.3.3 Active-High and Active-Low
      4. 7.3.4 Operates from a Single 5-V Supply
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable and Disable
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • W|16
  • J|16
  • FK|20
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.5 Thermal Information

THERMAL METRIC(1)J (CDIP)FK (LCCC)W (CFP)UNIT
16 PINS20 PINS16 PINS
RθJAJunction-to-ambient thermal resistance

65.6

61.6

99.5°C/W
RθJC(top)Junction-to-case(top) thermal resistance

54.6

36.8

51.5°C/W
RθJBJunction-to-board thermal resistance

42.1

36.1

86.5°C/W
ΨJTJunction-to-top characterization parameter

22.9

31

23.7°C/W
ΨJBJunction-to-bottom characterization parameter

41.6

36

80.2°C/W
RθJC(bottom)Junction-to-case(bottom) thermal resistance

N/A

4.2

N/A

°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.