ZHCSKR7A February   2020  – February 2020 ADS8355

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型方框图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1      Absolute Maximum Ratings
    2. 6.2      ESD Ratings
    3. 6.3      Recommended Operating Conditions
    4. 6.4      Thermal Information
    5. 6.5      Electrical Characteristics
    6. Table 1. Timing Requirements
    7. Table 2. Switching Characteristics
    8. 6.6      Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Reference
      2. 7.3.2 Analog Inputs
        1. 7.3.2.1 Analog Input: Full-Scale Range Selection
        2. 7.3.2.2 Analog Input: Single-Ended and Pseudo-Differential Configurations
      3. 7.3.3 Transfer Function
    4. 7.4 Device Functional Modes
      1. 7.4.1 Conversion Data Read: Dual-SDO Mode (Default)
      2. 7.4.2 Conversion Data Read: Single-SDO Mode
      3. 7.4.3 Low-Power Modes
        1. 7.4.3.1 STANDBY Mode
        2. 7.4.3.2 PD (Power-Down) Mode
    5. 7.5 Programming
      1. 7.5.1 Register Read/Write Operation
    6. 7.6 Register Map
      1. 7.6.1 ADS8355 Registers
        1. 7.6.1.1  PD_STANDBY Register (Offset = 4h) [reset = 0h]
          1. Table 9. PD_STANDBY Register Field Descriptions
        2. 7.6.1.2  PD_KEY Register (Offset = 5h) [reset = 0h]
          1. Table 10. PD_KEY Register Field Descriptions
        3. 7.6.1.3  SDO_CTRL Register (Offset = Dh) [reset = 0h]
          1. Table 11. SDO_CTRL Register Field Descriptions
        4. 7.6.1.4  DATA_OUT_CTRL Register (Offset = 11h) [reset = 0h]
          1. Table 12. DATA_OUT_CTRL Register Field Descriptions
        5. 7.6.1.5  REF_SEL Register (Offset = 20h) [reset = 0h]
          1. Table 13. REF_SEL Register Field Descriptions
        6. 7.6.1.6  REFDAC_A_LSB Register (Offset = 24h) [reset = 0h]
          1. Table 14. REFDAC_A_LSB Register Field Descriptions
        7. 7.6.1.7  REFDAC_A_MSB Register (Offset = 25h) [reset = 0h]
          1. Table 15. REFDAC_A_MSB Register Field Descriptions
        8. 7.6.1.8  REFDAC_B_LSB Register (Offset = 26h) [reset = 0h]
          1. Table 16. REFDAC_B_LSB Register Field Descriptions
        9. 7.6.1.9  REFDAC_B_MSB Register (Offset = 27h) [reset = 0h]
          1. Table 17. REFDAC_B_MSB Register Field Descriptions
        10. 7.6.1.10 INPUT_CONFIG Register (Offset = 28h) [reset = 0h]
          1. Table 18. INPUT_CONFIG Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input Amplifier Selection
      2. 8.1.2 Charge Kickback Filter
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) ADS8355 UNIT
RTE (WQFN)
16 PINS
RθJA Junction-to-ambient thermal resistance 33.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 29.5 °C/W
RθJB Junction-to-board thermal resistance 7.3 °C/W
ΨJT Junction-to-top characterization parameter 0.2 °C/W
YJB Junction-to-board characterization parameter 7.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 0.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.