ZHCSCF3A May   2014  – August 2014 ADS7950-Q1 , ADS7951-Q1 , ADS7952-Q1 , ADS7953-Q1 , ADS7954-Q1 , ADS7956-Q1 , ADS7957-Q1 , ADS7958-Q1 , ADS7959-Q1 , ADS7960-Q1 , ADS7961-Q1

PRODUCTION DATA.  

  1. 特性
  2. 应用范围
  3. 说明
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configurations and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Handling Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: ADS7950-Q1, ADS7951-Q1, ADS7952-Q1, ADS7953-Q1
    6. 7.6  Electrical Characteristics: ADS7954-Q1, ADS7956-Q1, ADS7957-Q1
    7. 7.7  Electrical Characteristics: ADS7958-Q1, ADS7959-Q1, ADS7960-Q1, ADS7961-Q1
    8. 7.8  Timing Requirements
    9. 7.9  Typical Characteristics (All ADS79xx-Q1 Family Devices)
    10. 7.10 Typical Characteristics (12-Bit Devices Only)
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Device Operation
      2. 8.3.2 Device Power-up Sequence
      3. 8.3.3 Analog Input
      4. 8.3.4 Reference
      5. 8.3.5 Power Saving
    4. 8.4 Device Functional Modes
      1. 8.4.1 Channel Sequencing Modes
      2. 8.4.2 Device Programming and Mode Control
        1. 8.4.2.1 Mode Control Register
        2. 8.4.2.2 Program Registers
      3. 8.4.3 Operating In Manual Mode
      4. 8.4.4 Operating In Auto-1 Mode
      5. 8.4.5 Operating In Auto-2 Mode
      6. 8.4.6 Continued Operation In A Selected Mode
    5. 8.5 Digital Output Code
    6. 8.6 Programming: GPIO
      1. 8.6.1 GPIO Registers
      2. 8.6.2 Alarm Thresholds for GPIO Pins
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Unbuffered Multiplexer Output (MXO)
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 OPA192 Buffered Multiplexer Output (MXO)
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
    3. 9.3 Do's and Don'ts
  10. 10Power-Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档 
    2. 12.2 相关链接
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 术语表
  13. 13机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 器件和文档支持

12.1 文档支持

12.1.1 相关文档 

相关文档如下:

12.3 Trademarks

SPI is a trademark of Motorola Inc.

All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.5 术语表

SLYZ022TI 术语表

这份术语表列出并解释术语、首字母缩略词和定义。