ZHCSK88A September   2010  – September 2019 ADS7947 , ADS7948 , ADS7949

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     ADS794x 方框图
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions: ADS794x (12-, 10-, 8-Bit)
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: ADS7947 (12-Bit)
    6. 7.6  Electrical Characteristics: ADS7948 (10-Bit)
    7. 7.7  Electrical Characteristics: ADS7949 (8-Bit)
    8. 7.8  Timing Requirements
    9. 7.9  Switching Characteristics
    10. 7.10 Typical Characteristics: ADS7947, ADS7948, ADS7949
    11. 7.11 Typical Characteristics: ADS7947 (12-Bit)
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Multiplexer and ADC Input
      2. 8.3.2 Reference
      3. 8.3.3 Clock
      4. 8.3.4 ADC Transfer Function
      5. 8.3.5 Power-Down
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Operation
    5. 8.5 Programming
      1. 8.5.1 16-Clock Frame
      2. 8.5.2 32-Clock Frame
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Driving an ADC Without a Driving Op Amp
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 相关链接
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1) ADS794x UNIT
RTE (WQFN)
16 PINS
RθJA Junction-to-ambient thermal resistance 54.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 53.7 °C/W
RθJB Junction-to-board thermal resistance 19.2 °C/W
ψJT Junction-to-top characterization parameter 0.3 °C/W
ψJB Junction-to-board characterization parameter 14.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 5.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.