ZHCSFX8A January 2017 – August 2017 ADS7039-Q1
PRODUCTION DATA.
MIN | MAX | UNIT | |
---|---|---|---|
AVDD to GND | –0.3 | 3.9 | V |
DVDD to GND | –0.3 | 3.9 | V |
AINP to GND | –0.3 | AVDD + 0.3 | V |
AINM to GND | –0.3 | 0.3 | V |
Digital input voltage to GND | –0.3 | DVDD + 0.3 | V |
Storage temperature, Tstg | –60 | 150 | °C |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human-body model (HBM), per AEC Q100-002(1) | ±2000 | V |
Charged-device model (CDM), per AEC Q100-011 | ±1000 |
MIN | NOM | MAX | UNIT | ||
---|---|---|---|---|---|
AVDD | Analog supply voltage range | 2.35 | 3.6 | V | |
DVDD | Digital supply voltage range | 1.65 | 3.6 | V | |
TA | Operating free-air temperature | –40 | 125 | °C |
THERMAL METRIC(1) | ADS7039-Q1 | UNIT | |
---|---|---|---|
DCU (VSSOP) | |||
8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 181.8 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 50.8 | °C/W |
RθJB | Junction-to-board thermal resistance | 73.9 | °C/W |
ψJT | Junction-to-top characterization parameter | 1.0 | °C/W |
ψJB | Junction-to-board characterization parameter | 73.9 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
---|---|---|---|---|---|---|---|
ANALOG INPUT | |||||||
Full-scale input voltage span(1) | 0 | AVDD | V | ||||
Absolute input voltage range | AINP to GND | –0.1 | AVDD + 0.1 | V | |||
AINM to GND | –0.1 | 0.1 | |||||
CS | Sampling capacitance | 15 | pF | ||||
SYSTEM PERFORMANCE | |||||||
Resolution | 10 | Bits | |||||
NMC | No missing codes | 10 | Bits | ||||
INL | Integral nonlinearity | AVDD = 3 V | –0.8 | ±0.4 | 0.8 | LSB(2) | |
DNL | Differential nonlinearity | AVDD = 3 V | –0.7 | ±0.4 | 0.7 | LSB | |
EO | Offset error | Uncalibrated | ±3 | LSB | |||
Calibrated(6) | AVDD = 3 V | –2 | ±0.5 | 2 | |||
dVOS/dT | Offset error drift with temperature | ±10 | ppm/°C | ||||
EG | Gain error | AVDD = 3 V | –0.2 | ±0.1 | 0.2 | %FS | |
Gain error drift with temperature | No calibration | ±10 | ppm/°C | ||||
SAMPLING DYNAMICS | |||||||
tACQ | Acquisition time | 120 | ns | ||||
Maximum throughput rate | 32-MHz SCLK, AVDD = 2.35 V to 3.6 V | 2 | MHz | ||||
DYNAMIC CHARACTERISTICS | |||||||
SNR | Signal-to-noise ratio(4) | fIN = 2 kHz, AVDD = 3 V | 60 | 61 | dB | ||
THD | Total harmonic distortion(4)(3) | fIN = 2 kHz, AVDD = 3 V | –75 | dB | |||
SINAD | Signal-to-noise and distortion(4) | fIN = 2 kHz, AVDD = 3 V | 60 | 61 | dB | ||
SFDR | Spurious-free dynamic range(4) | fIN = 2 kHz, AVDD = 3 V | 80 | dB | |||
BW(fp) | Full-power bandwidth | At –3 dB, AVDD = 3 V | 25 | MHz | |||
DIGITAL INPUT/OUTPUT (CMOS Logic Family) | |||||||
VIH | High-level input voltage(5) | 0.65 × DVDD | DVDD + 0.3 | V | |||
VIL | Low-level input voltage(5) | –0.3 | 0.35 × DVDD | V | |||
VOH | High-level output voltage(5) | At Isource = 500 µA | 0.8 × DVDD | DVDD | V | ||
At Isource = 2 mA | DVDD – 0.45 | DVDD | |||||
VOL | Low-level output voltage(5) | At Isink = 500 µA | 0 | 0.2 × DVDD | V | ||
At Isink = 2 mA | 0 | 0.45 | |||||
POWER-SUPPLY REQUIREMENTS | |||||||
AVDD | Analog supply voltage | 2.35 | 3 | 3.6 | V | ||
DVDD | Digital I/O supply voltage | 1.65 | 3 | 3.6 | V | ||
IAVDD | Analog supply current | At 2 MSPS with AVDD = 3 V | 365 | 400 | µA | ||
IDVDD | Digital supply current | AVDD = 3 V, no load, no transitions | 10 | µA | |||
PD | Power dissipation | At 2 MSPS with AVDD = 3 V | 1.095 | 1.20 | mW |
MIN | TYP | MAX | UNIT | ||
---|---|---|---|---|---|
tACQ | Acquisition time | 120 | ns | ||
fSCLK | SCLK frequency | 0.016 | 28 | MHz | |
tSCLK | SCLK period | 35.7 | ns | ||
tPH_CK | SCLK high time | 0.45 | 0.55 | tSCLK | |
tPL_CK | SCLK low time | 0.45 | 0.55 | tSCLK | |
tPH_CS | CS high time | 30 | ns | ||
tSU_CSCK | Setup time: CS falling to SCLK falling | 12 | ns | ||
tD_CKCS | Delay time: last SCLK falling to CS rising | 10 | ns |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
fTHROUGHPUT | Throughput | 2 | MSPS | |||
tCYCLE | Cycle time | 0.5 | µs | |||
tCONV | Conversion time | 10.5 × tSCLK + tSU_CSCK | ns | |||
tDV_CSDO | Delay time: CS falling to data enable | 10 | ns | |||
tD_CKDO | Delay time: SCLK falling to (next) data valid on DOUT | AVDD = 2.35 V to 3.6 V | 25 | ns | ||
tDZ_CSDO | Delay time: CS rising to DOUT going to tri-state | 5 | ns |
SNR = 61.39 dB, THD = –80.82 dB, fIN = 2 kHz, AVDD = 3 V |
fIN = 2 kHz, AVDD = 3 V |
fIN = 2 kHz |
fIN = 2 kHz, AVDD = 3 V |
fIN = 2 kHz, AVDD = 3 V |
AVDD = 2.35 V |
AVDD = 3 V |
AVDD = 3 V |
AVDD = DVDD = 3.3 V |
AVDD = DVDD = 3.3 V |
SNR = 61.21 dB, THD = –77.09, fIN = 250 kHz, AVDD = 3 V |
AVDD = 3 V |
fIN = 2 kHz, AVDD = 3 V |
AVDD = 3 V |
fIN = 2 kHz, AVDD = 3 V |
Mean code = 512, sigma = 0.06, AVDD = 3 V |
AVDD = 2.35 V |
AVDD = 3 V |
AVDD = 3 V |
AVDD = 3 V |
AVDD = 3 V |
fSample = 2 MSPS |
AVDD = DVDD = 3.3 V |
AVDD = DVDD = 3.3 V |