ZHCS158C July   2012  – January 2017 ADS1299 , ADS1299-4 , ADS1299-6

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: Serial Interface
    7. 7.7 Switching Characteristics: Serial Interface
    8. 7.8 Typical Characteristics
  8. 8 Parametric Measurement Information
    1. 8.1 Noise Measurements
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Analog Functionality
        1. 9.3.1.1 Input Multiplexer
          1. 9.3.1.1.1 Device Noise Measurements
          2. 9.3.1.1.2 Test Signals (TestP and TestN)
          3. 9.3.1.1.3 Temperature Sensor (TempP, TempN)
          4. 9.3.1.1.4 Supply Measurements (MVDDP, MVDDN)
          5. 9.3.1.1.5 Lead-Off Excitation Signals (LoffP, LoffN)
          6. 9.3.1.1.6 Auxiliary Single-Ended Input
        2. 9.3.1.2 Analog Input
        3. 9.3.1.3 PGA Settings and Input Range
          1. 9.3.1.3.1 Input Common-Mode Range
          2. 9.3.1.3.2 Input Differential Dynamic Range
          3. 9.3.1.3.3 ADC ΔΣ Modulator
          4. 9.3.1.3.4 Reference
      2. 9.3.2 Digital Functionality
        1. 9.3.2.1 Digital Decimation Filter
          1. 9.3.2.1.1 Sinc Filter Stage (sinx / x)
        2. 9.3.2.2 Clock
        3. 9.3.2.3 GPIO
        4. 9.3.2.4 ECG and EEG Specific Features
          1. 9.3.2.4.1 Input Multiplexer (Rerouting the BIAS Drive Signal)
          2. 9.3.2.4.2 Input Multiplexer (Measuring the BIAS Drive Signal)
          3. 9.3.2.4.3 Lead-Off Detection
            1. 9.3.2.4.3.1 DC Lead-Off
            2. 9.3.2.4.3.2 AC Lead-Off (One Time or Periodic)
          4. 9.3.2.4.4 Bias Lead-Off
          5. 9.3.2.4.5 Bias Drive (DC Bias Circuit)
            1. 9.3.2.4.5.1 Bias Configuration with Multiple Devices
    4. 9.4 Device Functional Modes
      1. 9.4.1 Start
        1. 9.4.1.1 Settling Time
      2. 9.4.2 Reset (RESET)
      3. 9.4.3 Power-Down (PWDN)
      4. 9.4.4 Data Retrieval
        1. 9.4.4.1 Data Ready (DRDY)
        2. 9.4.4.2 Reading Back Data
      5. 9.4.5 Continuous Conversion Mode
      6. 9.4.6 Single-Shot Mode
    5. 9.5 Programming
      1. 9.5.1 Data Format
      2. 9.5.2 SPI Interface
        1. 9.5.2.1 Chip Select (CS)
        2. 9.5.2.2 Serial Clock (SCLK)
        3. 9.5.2.3 Data Input (DIN)
        4. 9.5.2.4 Data Output (DOUT)
      3. 9.5.3 SPI Command Definitions
        1. 9.5.3.1  Sending Multi-Byte Commands
        2. 9.5.3.2  WAKEUP: Exit STANDBY Mode
        3. 9.5.3.3  STANDBY: Enter STANDBY Mode
        4. 9.5.3.4  RESET: Reset Registers to Default Values
        5. 9.5.3.5  START: Start Conversions
        6. 9.5.3.6  STOP: Stop Conversions
        7. 9.5.3.7  RDATAC: Read Data Continuous
        8. 9.5.3.8  SDATAC: Stop Read Data Continuous
        9. 9.5.3.9  RDATA: Read Data
        10. 9.5.3.10 RREG: Read From Register
        11. 9.5.3.11 WREG: Write to Register
    6. 9.6 Register Maps
      1. 9.6.1 User Register Description
        1. 9.6.1.1  ID: ID Control Register (address = 00h) (reset = xxh)
        2. 9.6.1.2  CONFIG1: Configuration Register 1 (address = 01h) (reset = 96h)
        3. 9.6.1.3  CONFIG2: Configuration Register 2 (address = 02h) (reset = C0h)
        4. 9.6.1.4  CONFIG3: Configuration Register 3 (address = 03h) (reset = 60h)
        5. 9.6.1.5  LOFF: Lead-Off Control Register (address = 04h) (reset = 00h)
        6. 9.6.1.6  CHnSET: Individual Channel Settings (n = 1 to 8) (address = 05h to 0Ch) (reset = 61h)
        7. 9.6.1.7  BIAS_SENSP: Bias Drive Positive Derivation Register (address = 0Dh) (reset = 00h)
        8. 9.6.1.8  BIAS_SENSN: Bias Drive Negative Derivation Register (address = 0Eh) (reset = 00h)
        9. 9.6.1.9  LOFF_SENSP: Positive Signal Lead-Off Detection Register (address = 0Fh) (reset = 00h)
        10. 9.6.1.10 LOFF_SENSN: Negative Signal Lead-Off Detection Register (address = 10h) (reset = 00h)
        11. 9.6.1.11 LOFF_FLIP: Lead-Off Flip Register (address = 11h) (reset = 00h)
        12. 9.6.1.12 LOFF_STATP: Lead-Off Positive Signal Status Register (address = 12h) (reset = 00h)
        13. 9.6.1.13 LOFF_STATN: Lead-Off Negative Signal Status Register (address = 13h) (reset = 00h)
        14. 9.6.1.14 GPIO: General-Purpose I/O Register (address = 14h) (reset = 0Fh)
        15. 9.6.1.15 MISC1: Miscellaneous 1 Register (address = 15h) (reset = 00h)
        16. 9.6.1.16 MISC2: Miscellaneous 2 (address = 16h) (reset = 00h)
        17. 9.6.1.17 CONFIG4: Configuration Register 4 (address = 17h) (reset = 00h)
  10. 10Applications and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Unused Inputs and Outputs
      2. 10.1.2 Setting the Device for Basic Data Capture
        1. 10.1.2.1 Lead-Off
        2. 10.1.2.2 Bias Drive
      3. 10.1.3 Establishing the Input Common-Mode
      4. 10.1.4 Multiple Device Configuration
        1. 10.1.4.1 Cascaded Mode
        2. 10.1.4.2 Daisy-Chain Mode
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Power-Up Sequencing
    2. 11.2 Connecting the Device to Unipolar (5 V and 3.3 V) Supplies
    3. 11.3 Connecting the Device to Bipolar (±2.5 V and 3.3 V) Supplies
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 文档支持
      1. 13.1.1 相关文档　
    2. 13.2 相关链接
    3. 13.3 接收文档更新通知
    4. 13.4 社区资源
    5. 13.5 商标
    6. 13.6 静电放电警告
    7. 13.7 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

13 器件和文档支持

13.1 文档支持

13.1.1 相关文档　

相关文档如下：

13.2 相关链接

以下表格列出了快速访问链接。范围包括技术文档、支持与社区资源、工具和软件，并且可通过快速访问立刻订购。

Table 31. 相关链接

器件 产品文件夹 立即订购 技术文档 工具与软件 支持与社区
ADS1299 请单击此处 请单击此处 请单击此处 请单击此处 请单击此处
ADS1299-4 请单击此处 请单击此处 请单击此处 请单击此处 请单击此处
ADS1299-6 请单击此处 请单击此处 请单击此处 请单击此处 请单击此处

13.3 接收文档更新通知

如需接收文档更新通知，请访问 www.ti.com.cn 网站上的器件产品文件夹。点击右上角的提醒我 (Alert me) 注册后，即可每周定期收到已更改的产品信息。有关更改的详细信息，请查阅已修订文档中包含的修订历史记录。

13.4 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.5 商标

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

13.6 静电放电警告

esds-image

ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。

13.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.