ZHCSA21C FEBRUARY   2013  – December 2014 ADS1293

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 应用图
  5. 5 修订历史记录
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Write Timing Requirements
    7. 7.7 Read Timing Requirements
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Flexible Routing Switch
      2. 8.3.2  Battery Monitoring
      3. 8.3.3  Test Mode
      4. 8.3.4  Analog Front-End
      5. 8.3.5  Instrumentation Amplifier (INA)
        1. 8.3.5.1 Instrumentation Amplifier Fault Detection
      6. 8.3.6  Sigma-Delta Modulator (SDM)
        1. 8.3.6.1 Sigma-Delta Modulator Fault Detection
      7. 8.3.7  Programmable Digital Filters
      8. 8.3.8  Filter Settling Time
      9. 8.3.9  Analog Pace Channel
      10. 8.3.10 Wilson Reference
        1. 8.3.10.1 Wilson Central Terminal
        2. 8.3.10.2 Goldberger Terminals
      11. 8.3.11 Common-Mode (CM) Detector
        1. 8.3.11.1 Cable Shield Driving
        2. 8.3.11.2 Common-Mode Output Range (CMOR)
      12. 8.3.12 Right-Leg Drive (RLD)
      13. 8.3.13 Capacitive Load Driving
      14. 8.3.14 Error Status: RLD Rail
      15. 8.3.15 Lead-Off Detection (LOD)
      16. 8.3.16 DC Lead-Off Detect
      17. 8.3.17 Analog AC Lead-Off Detect
      18. 8.3.18 Digital AC Lead-Off Detect
      19. 8.3.19 Clock Oscillator
      20. 8.3.20 Synchronization
      21. 8.3.21 Single-Chip Multi-Channel Synchronization
      22. 8.3.22 Multichip Synchronization
      23. 8.3.23 Synchronization Errors
      24. 8.3.24 Alarm Functions
      25. 8.3.25 Error Filtering
      26. 8.3.26 ALARMB Pin and Error Masking
      27. 8.3.27 Error Register Automatic Clearing Description
      28. 8.3.28 Alarm Propagation
      29. 8.3.29 Reference Voltage Generators
      30. 8.3.30 Power Management
    4. 8.4 Device Functional Modes
      1. 8.4.1 Low Sampling Rate
      2. 8.4.2 High Sampling Rate
      3. 8.4.3 Ouput Code (ADCOUT)
    5. 8.5 Programming
      1. 8.5.1 Serial Digital Interface
      2. 8.5.2 Digital Output Drive Strength
      3. 8.5.3 SPI Protocol
      4. 8.5.4 Random Register Access Protocol
      5. 8.5.5 Auto-Incrementing Address
      6. 8.5.6 Streaming
      7. 8.5.7 Data Ready Bar
      8. 8.5.8 Simultaneous ECG and Pace Data Read
    6. 8.6 Register Maps
      1. 8.6.1  Operation Mode Registers
      2. 8.6.2  Input Channel Selection Registers
      3. 8.6.3  Lead-Off Detect Control Registers
      4. 8.6.4  Common-Mode Detection and Right-Leg Drive Common-Mode Feedback Control Registers
      5. 8.6.5  Wilson Control Registers
      6. 8.6.6  Reference Registers
      7. 8.6.7  OSC Control Registers
      8. 8.6.8  AFE Control Registers
      9. 8.6.9  Error Status Registers
      10. 8.6.10 Digital Registers
      11. 8.6.11 Pace and ECG Data Read Back Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 3-Lead ECG Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 5-Lead ECG Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 8- or 12-Lead ECG Application
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 商标
    2. 12.2 静电放电警告
    3. 12.3 术语表
  13. 13机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 器件和文档支持

12.1 商标

All other trademarks are the property of their respective owners.

12.2 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

12.3 术语表

SLYZ022 — TI 术语表。

这份术语表列出并解释术语、首字母缩略词和定义。