可提供此产品的更新版本
功能与比较器件相同但引脚有所不同
UCC2818A-Q1
- Qualified for Automotive Applications
- Controls Boost Preregulator to Near-Unity
Power Factor - Limits Line Distortion
- World-Wide Line Operation
- Overvoltage Protection
- Accurate Power Limiting
- Average Current Mode Control
- Improved Noise Immunity
- Improved Feed-Forward Line Regulation
- Leading Edge Modulation
- 150-µA Typical Start-Up Current
- Low-Power BiCMOS Operation
- 12-V to 17-V Operation
- Frequency Range of 6 kHz to 220 kHz
The UCC2818A-Q1 device provides all the functions necessary for active power factor corrected preregulators. The controller achieves near unity power factor by shaping the ac input line current waveform to correspond to that of the ac input line voltage. Average current mode control maintains stable, low distortion sinusoidal line current.
Designed in Texas Instrument’s BiCMOS process, the UCC2818A-Q1 device offers new features such as lower start-up current, lower power dissipation, overvoltage protection, a shunt UVLO detect circuitry, a leading-edge modulation technique to reduce ripple current in the bulk capacitor and an improved, low-offset (±2 mV) current amplifier to reduce distortion at light load conditions.
The UCC2818A-Q1 PFC controller is directly pin-for-pin compatible with the UCC2818 devices. Only the output stage of UCC2818A-Q1 device has been modified to allow use of a smaller external gate drive resistor values. For some power supply designs where an adequately high enough gate drive resistor can not be used, the UCC2818A-Q1 device offers a more robust output stage at the cost of increasing the internal gate resistances. The gate drive of the UC2818A, however, remains strong at ±1.2 A of peak current capability.
The UCC2818A-Q1 device is intended for applications with a fixed supply (VCC). It is available in the 16-pin D package.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | UCC2818A-Q1 BiCMOS Power-Factor Preregulator 数据表 (Rev. A) | PDF | HTML | 2014年 12月 11日 |
设计和开发
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订购和质量
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- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点