TPA4411
- Space Saving Packages
- 20-Pin, 4 mm × 4 mm Thin QFN
- PA4411 — Thermally Optimized PowerPAD™ Package
- TTPA4411M — Thermally Enhanced PowerPAD™ Package
- 16-Ball, 2.18 mm × 2.18 mm WCSP
- 20-Pin, 4 mm × 4 mm Thin QFN
- Ground-Referenced Outputs Eliminate
DC-Bias Voltages on Headphone Ground Pin- No Output DC-Blocking Capacitors
- Reduced Board Area
- Reduced Component Cost
- Improved THD+N Performance
- No Degradation of Low-Frequency Response Due to Output Capacitors
- Wide Power Supply Range: 1.8 V to 4.5 V
- 80-mW/Ch Output Power into 16- at 4.5 V
- Independent Right and Left Channel
Shutdown Control - Short-Circuit and Thermal Protection
- Pop Reduction Circuitry
- No Output DC-Blocking Capacitors
- APPLICATIONS
- Notebook Computers
- CD / MP3 Players
- Smart Phones
- Cellular Phones
- PDAs
The TPA4411 and TPA4411M are stereo headphone drivers designed to allow the removal of the output DC-blocking capacitors for reduced component count and cost. The TPA4411 and TPA4411M are ideal for small portable electronics where size and cost are critical design parameters.
The TPA4411 and TPA4411M are capable of driving 80 mW into a 16- load at 4.5 V. Both TPA4411 and TPA4411M have a fixed gain of 1.5 V/V and headphone outputs that have ±8-kV IEC ESD protection. The TPA4411 and TPA4411M have independent shutdown control for the right and left audio channels.
The TPA4411 is available in a 2.18 mm × 2.18 mm WCSP and 4 mm × 4 mm Thin QFN packages. The TPA4411M is available in a 4 mm × 4 mm Thin QFN package. The TPA4411RTJ package is a thermally optimized PowerPAD package allowing the maximum amount of thermal dissipation and the TPA4411MRTJ is a thermally enhanced PowerPAD package designed to match competitive package footprints.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | 80-mW DirectPath(TM) Stereo Headphone Driver 数据表 (Rev. E) | 2008年 3月 4日 | |||
应用手册 | Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) | 2019年 8月 26日 | ||||
应用手册 | AN-1849 An Audio Amplifier Power Supply Design (Rev. C) | 2019年 6月 27日 | ||||
更多文献资料 | Журнал по применению аналоговых компонентов 2кв. 2010 | 2011年 8月 8日 | ||||
模拟设计期刊 | 用于将 APA 输出连接至其它器件的预防措施 | 英语版 | 2011年 4月 5日 | |||
模拟设计期刊 | 2Q 2010 Issue Analog Applications Journal | 2010年 5月 6日 | ||||
EVM 用户指南 | TPA4411EVM - User Guide (Rev. A) | 2008年 1月 9日 | ||||
更多文献资料 | TPA4411_NanoEVM_ Schematic | 2007年 2月 13日 | ||||
更多文献资料 | TPA4411_NanoEVM_OV | 2007年 1月 29日 |
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
TPA4411EVM — TPA4411 评估模块 (EVM)
The TPA4411 is a stereo headphone driver evaluation module. The TPA4411 device is designed to allow the removal of the output DC-blocking capacitors for reduced component count and cost. The evaluation module consists of a TI TPA4411 80-mW audio power amplifier in a small QFN package. It is ideal (...)
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封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
DSBGA (YZH) | 16 | Ultra Librarian |
WQFN (RTJ) | 20 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点
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