ZHCSGK6 July   2017 ONET2804TLP

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 DC Electrical Characteristics
    5. 6.5 AC Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics: General
    8. 6.8 Typical Characteristics: Eye Diagrams
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Signal Path
      2. 7.3.2 Gain Adjustment
      3. 7.3.3 Amplitude Adjustment
      4. 7.3.4 Rate Select
      5. 7.3.5 Threshold Adjustment
      6. 7.3.6 Filter Circuitry
      7. 7.3.7 AGC and RSSI
    4. 7.4 Device Functional Modes
      1. 7.4.1 Pad Control
      2. 7.4.2 Two-Wire Interface Control
    5. 7.5 Programming
      1. 7.5.1 Bus Idle
      2. 7.5.2 Start Data Transfer
      3. 7.5.3 Stop Data Transfer
      4. 7.5.4 Data Transfer
      5. 7.5.5 Acknowledge
    6. 7.6 Register Maps
      1. 7.6.1  Register Descriptions
      2. 7.6.2  Register 0: Control Settings (address = 00h) [reset = 0h]
      3. 7.6.3  Register 1: Amplitude and Rate for Channel 1 (address = 01h) [reset = 0h]
      4. 7.6.4  Register 2: Threshold and Gain for Channel 1 (address = 02h) [reset = 0h]
      5. 7.6.5  Register 7: Amplitude and Rate for Channel 2 (address = 07h) [reset = 0h]
      6. 7.6.6  Register 8: Threshold and Gain for Channel 1 (address = 08h) [reset = 0h]
      7. 7.6.7  Register 13: Amplitude and Rate for Channel 3 (address = 0Dh) [reset = 0h]
      8. 7.6.8  Register 14: Threshold and Gain for Channel 3 (address = 0Eh) [reset = 0h]
      9. 7.6.9  Register 19: Amplitude and Rate for Channel 4 (address = 13h) [reset = 0h]
      10. 7.6.10 Register 20: Threshold and Gain for Channel 4 (address = 14h) [reset = 0h]
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Pad Control Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Two-Wire Control Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
  • Y|0
散热焊盘机械数据 (封装 | 引脚)
订购信息

Layout

Layout Guidelines

Careful attention to assembly parasitics and external components is necessary to achieve optimal performance.

  • Minimize the total capacitance on the INx pad by using a low capacitance photodiode (100 fF) and pay attention to stray capacitances. Place the photodiode close to the ONET2804TLP die and keep the wire bond inductance in the range of 300 pH to 400 pH.
  • Use identical termination and symmetrical transmission lines at the AC-coupled differential output pins (OUTx+ and OUTx–).
  • Use short bond wire connections for the supply pins VCCIx, VCCOx, and GND. Supply voltage filtering is provided on-chip but filtering can be improved by using an additional external capacitor.
  • The die has backside metal and conductive epoxy must be used to attach the die to ground.

Layout Example

The device dimensions are shown in Figure 28 and Table 15 provides the pad locations. The device is designed for wire bonding not flip chip layouts.

ONET2804TLP sbas796_padout_with_dimensions.gif Figure 28. Device Dimensions and Pad Locations

Die thickness: 203 µm ± 13 μm
Pad dimensions: 105 μm × 65 μm
Die size: 3250 μm ± 40 µm × 1450 μm ± 40 µm

Table 15. Bond Pad Coordinates

PAD COORDINATES
(Referenced to Pad 1)
SYMBOL TYPE DESCRIPTION
X (µm) Y (µm)
1 0 0 VCCO1 Supply 3.3-V supply voltage
2 0 –94 VCCO2 Supply 3.3-V supply voltage
3 0 –188 VCCI2 Supply 3.3-V supply voltage
4 0 –282 VCCI1 Supply 3.3-V supply voltage
5 0 –376 I2CENA Digital input I2C enable
6 0 –470 AMPL Digital input Amplitude control
7 0 –580 RATE Digital input Rate selection
8 0 –704 GAIN Digital input Gain control
9 0 –814 RSSI1 Analog output Receiver signal strength indicator for channel 1
10 0 –908 RSSI2 Analog output Receiver signal strength indicator for channel 2
11 180 –1110 GND Supply Circuit ground
12 290 –1110 FILTER1 Analog output Bias voltage for photodiode 1
13 400 –1110 IN1 Analog input TIA input for channel 1
14 510 –1110 FILTER1 Analog output Bias voltage for photodiode 1
15 620 –1110 GND Supply Circuit ground
16 720 –1110 NC No connection Do not connect
17 829 –1110 NC No connection Do not connect
18 929 –1110 GND Supply Circuit ground
19 1039 –1110 FILTER2 Analog output Bias voltage for photodiode 2
20 1149 –1110 IN2 Analog input TIA input for channel 2
21 1259 –1110 FILTER2 Analog output Bias voltage for photodiode 2
22 1369 –1110 GND Supply Circuit ground
23 1469 –1110 NC No connect Do not connect
24 1580 –1110 NC No connect Do not connect
25 1680 –1110 GND Supply Circuit ground
26 1790 –1110 FILTER3 Analog output Bias voltage for photodiode 3
27 1900 –1110 IN3 Analog input TIA input for channel 3
28 2010 –1110 FILTER3 Analog output Bias voltage for photodiode 3
29 2120 –1110 GND Supply Circuit ground
30 2239 –1110 NC No connect Do not connect
31 2329 –1110 NC No connect Do not connect
32 2429 –1110 GND Supply Circuit ground
33 2539 –1110 FILTER4 Analog output Bias voltage for photodiode 4
34 2649 –1110 IN4 Analog input TIA input for channel 4
35 2759 –1110 FILTER4 Analog output Bias voltage for photodiode 4
36 2869 –1110 GND Supply Circuit ground
37 3051 –908 RSSI3 Analog output Receiver signal strength indicator for channel 3
38 3051 –814 RSSI4 Analog output Receiver signal strength indicator for channel 4
39 3051 –704 SDA Digital input/output 2-wire data
40 3051 –579 SCL Digital input 2-wire clock
41 3051 –470 TRSH Digital input Input threshold control (cross-point)
42 3051 –376 NC No connect Do not connect
43 3051 –282 VCCI4 Supply 3.3-V supply voltage
44 3051 –188 VCCI3 Supply 3.3-V supply voltage
45 3051 –94 VCCO3 Supply 3.3-V supply voltage
46 3051 0 VCCO4 Supply 3.3-V supply voltage
47 2888 140 GND Supply Circuit ground
48 2799 140 GND Supply Circuit ground
49 2699 140 OUT4– Analog output Inverted data output for channel 4
50 2599 140 OUT4+ Analog output Noninverted data output for channel 4
51 2499 140 GND Supply Circuit ground
52 2410 140 GND Supply Circuit ground
53 2322 140 ADR1 Digital input 2-wire address bit 1 control
54 2228 140 ADR0 Digital input 2-wire address bit 0 control
55 2139 140 GND Supply Circuit ground
56 2050 140 GND Supply Circuit ground
57 1950 140 OUT3– Analog output Inverted data output for channel 3
58 1850 140 OUT3+ Analog output Noninverted data output for channel 3
59 1750 140 GND Supply Circuit ground
60 1661 140 GND Supply Circuit ground
61 1572 140 NC No connection Do not connect
62 1477 140 NC No connection Do not connect
63 1388 140 GND Supply Circuit ground
64 1299 140 GND Supply Circuit ground
65 1199 140 OUT2– Analog output Inverted data output for channel 2
66 1099 140 OUT2+ Analog output Noninverted data output for channel 2
67 999 140 GND Supply Circuit ground
68 910 140 GND Supply Circuit ground
69 821 140 NC No connect Do not connect
70 728 140 NRESET Digital input 2-wire negative reset
71 639 140 GND Supply Circuit ground
72 550 140 GND Supply Circuit ground
73 450 140 OUT1– Analog output Inverted data output for channel 1
74 350 140 OUT1+ Analog output Noninverted data output for channel 1
75 250 140 GND Supply Circuit ground
76 161 140 GND Supply Circuit ground