LP5904
- Stable with 1.0 µF Ceramic Input and Output Capacitors
- No Noise Bypass Capacitor Required
- Remote Output Capacitor Placement
- Thermal-overload and Short-circuit Protection
- –40°C to +125°C Junction Temperature Range for Operation
Key Specifications
- Input Voltage Range … 2.2V to 5.5V
- Output Voltage Range … 1.2V to 4.4V
- Output Current … 200 mA
- Low Output Voltage Noise at
200 mA … 6.5µVRMS - PSRR … 78 dB at 1kHz
- Output Voltage Tolerance … ± 2%
- Virtually Zero IQ (Disabled) … <1 µA
- Very Low IQ (Enabled) … 11 µA
- Startup Time … 85 µs
- Low Dropout … 95 mV typ
Package
- 4-Bump DSBGA (lead free)
0.815 mm × 0.815 mm × 0.600 mm
The LP5904 is a linear regulator capable of supplying 200 mA output current. Designed to meet the requirements of RF/ Analog circuits, the LP5904 device provides low noise, high PSRR, low quiescent current, and low line transient response figures. Using new innovative design techniques the LP5904 offers class-leading device noise performance without a noise bypass capacitor and the ability for remote output capacitor placement. An active pulldown circuit with a 280Ω resistor is wired from the output to ground pins to quickly discharge output when the device is disabled (VEN = low).
The device is designed to work with a 1.0 µF input and a 1.0 µF output ceramic capacitor. (No Bypass Capacitor is required.)
The device is available in a DSBGA package. For other package options contact your local TI sales office.
This device is available between 1.2V and 4.4V in
25 mV steps. Please contact Texas Instruments Sales for specific voltage option needs.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | LP5904 Ultra Low Noise 200mA Linear Reg for RF/Analog Circuits 数据表 (Rev. G) | 2013年 4月 17日 | |||
选择指南 | 电源管理指南 2018 (Rev. K) | 2018年 7月 31日 | ||||
选择指南 | 电源管理指南 2018 (Rev. R) | 2018年 6月 25日 | ||||
用户指南 | AN-2161 LP5904 DSBGA Evaluation Board Information (Rev. A) | 2013年 4月 30日 | ||||
应用手册 | AN-2146 Power Design for SDI and Other Noise-Sensitive Devices (Rev. A) | 2013年 4月 26日 |
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
封装 | 引脚 | 下载 |
---|---|---|
DSBGA (YFQ) | 4 | 查看选项 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点