DRV8808
- Three DC Motor Drivers
- Up to 2.5-A Current Chopping
- Low Typical ON Resistance (RDSON = 0.5 Ω at TJ = 25°C)
- Three Integrated DC-DC Converters
- ON/OFF Selectable Using CSELECT Pin and Serial Interface
- Outputs Configurable With External Resistor Network From 1 V to 90% of VM Capability for All Three Channels
- 1.35-A Output Capability for All Three Channels
- One Integrated LDO Regulator
- Output Configurable With External Resistor Network from 1 V to 2.5 V
- 550-mA Output Capability
- 7-V to 40-V Operating Range
- Serial Interface for Communications
- Thermally Enhanced Surface-Mount Package
48-Pin HTSSOP With PowerPAD
(Eco-Friendly: RoHS and No Sb/Br ) - Power-Down Function (Deep-Sleep Mode)
- Reset Signal Output (Active Low)
- Reset (All Clear) Control Input
PowerPAD is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners
The DRV8808 device provides the integrated motor driver solution for printers. The chip has three full H-bridges and three buck DC-DC converters.
The output driver block for each consists of N-channel power MOSFETs configured as full H-bridges to drive the motor windings. The device can be configured to use internal or external current sense for winding current control.
The SPI input pins are 3.3-V compatible and have inputs that are 5-V tolerant.
The DRV8808 has three DC-DC switched-mode buck converters to generate a programmable output voltage from 1 V up to 90% of VM, with up to 1.35-A load current capability.
The device is configured using the CSELECT terminal at start-up, and serial interface during run time.
An internal shutdown function is provided for overcurrent protection, short-circuit protection, undervoltage lockout, and thermal shutdown. Also, the device has the reset function at power on, and the input on the nReset pin.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | DRV8808 Combination Motor Driver With DC-DC Converter 数据表 (Rev. B) | PDF | HTML | 2015年 1月 31日 | ||
应用手册 | PowerPAD™ Thermally Enhanced Package (Rev. H) | 2018年 7月 6日 | ||||
应用手册 | 所选封装材料的热学和电学性质 | 2008年 10月 16日 | ||||
应用简报 | PowerPAD® 轻松实现 (Rev. B) | 2004年 5月 12日 |
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
封装 | 引脚 | 下载 |
---|---|---|
HTSSOP (DCA) | 48 | 查看选项 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点