Engicam s.r.l.

System on module vendor for TI Arm-based processors with in-house manufacturing and design services

ENGICAM is focused on designing, developing, and producing high-performance embedded computing products focused on the following core principles:

Longevity: All modules have a guaranteed long-term production availability, up to 15 years from CPU launch.

Smallest form factor: For easy integration, modules are designed and developed taking care to minimize the form factor.

Robustness: Engicam modules are proven in hundreds of different applications under extremely hard thermal and mechanical operating conditions.

Scalability: The majority of Engicam modules are available in SODIMM, MicroGEA, or SMARC formats and are mutually compatible for a complete scalability.

基于 Arm 的处理器
AM623 具有基于 Arm® Cortex®-A53 的对象和手势识别功能的物联网 (IoT) 和网关 SoC AM625 具有基于 Arm® Cortex®-A53 的边缘 AI 和全高清双显示的人机交互 SoC
联系人
提供的资源
  • 评估板
支持的地区
  • 中国
  • 亚洲其他地区
  • 北美
  • 南美洲
  • 印度
  • 大洋洲
  • 日本
  • 欧洲
  • 非洲
公司总部
  • Via dei Pratoni, 16
  • 50018 Scandicci (Florence) Italy
  • Florence, 50018
  • Italy

资源

评估板

ENGCM-3P-ICORE-AM62X — Engicam i.Core-AM62x SO-DIMM system on module for AM623 and AM625 Arm Cortex-A53 1.4-GHz processors

The new i.Core AM62x system on module is based on the AM623 and AM625 processor device families, and the module is equipped to optimally take advantage of the 1-4 Arm® Cortex®-A53 CPU cores at up to 1.4-GHz and Cortex-M4F MCU co-processor at up to 400MHz. The cost-optimized module will (...)

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