ZHCSO08A December   2021  – November 2022 LMH5485-SEP

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: Vs+ – Vs- = 5 V
    6. 7.6 Electrical Characteristics: Vs+ – Vs- = 3 V
    7. 7.7 Typical Characteristics: 5 V Single Supply
    8. 7.8 Typical Characteristics: 3 V Single Supply
    9. 7.9 Typical Characteristics: 3 V to 5 V Supply Range
  8. Parameter Measurement Information
    1. 8.1 Example Characterization Circuits
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Differential I/O
      2. 9.3.2 Power-Down Control Pin (PD)
        1. 9.3.2.1 Operating the Power Shutdown Feature
      3. 9.3.3 Input Overdrive Operation
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operation from Single-Ended Sources to Differential Outputs
        1. 9.4.1.1 AC-Coupled Signal Path Considerations for Single-Ended Input to Differential Output Conversion
        2. 9.4.1.2 DC-Coupled Input Signal Path Considerations for Single-Ended to Differential Conversion
      2. 9.4.2 Differential-Input to Differential-Output Operation
        1. 9.4.2.1 AC-Coupled, Differential-Input to Differential-Output Design Issues
        2. 9.4.2.2 DC-Coupled, Differential-Input to Differential-Output Design Issues
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Designing Attenuators
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Interfacing to High-Performance ADCs
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 支持资源
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 术语表
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DGK|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

特性

  • 抗辐射
    • 每个晶圆批次的保障 TID 高达 30krad (Si)
    • 单粒子闩锁 (SEL) 对于 LET 的
      抗扰度 = 43MeV-cm2/mg
    • 支持军用级温度范围:-55°C 至 125°C
  • 增益带宽积(GBWP):850MHz
  • 压摆率:1300V/µs
  • HD2、HD3:–118dBc、–147dBc(100kHz、2VPP
  • 输入电压噪声:2.4 nV/√Hz
  • 低温漂:±0.5µV/°C(典型值)
  • 负轨输入 (NRI)、轨到轨输出 (RRO)
  • 电源:
    • 电源电压范围:2.7V 至 5.4V
    • 静态电流:10.1 mA
    • 断电能力:2µA(典型值)