ZHCSN42A August   2021  – May 2022 ADC08DJ5200RF

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: DC Specifications
    6. 6.6  Electrical Characteristics: Power Consumption
    7. 6.7  Electrical Characteristics: AC Specifications (Dual-Channel Mode)
    8. 6.8  Electrical Characteristics: AC Specifications (Single-Channel Mode)
    9. 6.9  Timing Requirements
    10. 6.10 Switching Characteristics
    11. 6.11 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Comparison
      2. 7.3.2 Analog Inputs
        1. 7.3.2.1 Analog Input Protection
        2. 7.3.2.2 Full-Scale Voltage (VFS) Adjustment
        3. 7.3.2.3 Analog Input Offset Adjust
      3. 7.3.3 ADC Core
        1. 7.3.3.1 ADC Theory of Operation
        2. 7.3.3.2 ADC Core Calibration
        3. 7.3.3.3 Analog Reference Voltage
        4. 7.3.3.4 ADC Overrange Detection
        5. 7.3.3.5 Code Error Rate (CER)
      4. 7.3.4 Temperature Monitoring Diode
      5. 7.3.5 Timestamp
      6. 7.3.6 Clocking
        1. 7.3.6.1 Noiseless Aperture Delay Adjustment (tAD Adjust)
        2. 7.3.6.2 Aperture Delay Ramp Control (TAD_RAMP)
        3. 7.3.6.3 SYSREF Capture for Multi-Device Synchronization and Deterministic Latency
          1. 7.3.6.3.1 SYSREF Position Detector and Sampling Position Selection (SYSREF Windowing)
          2. 7.3.6.3.2 Automatic SYSREF Calibration
      7. 7.3.7 Programmable FIR Filter (PFIR)
        1. 7.3.7.1 Dual Channel Equalization
        2. 7.3.7.2 Single Channel Equalization
        3. 7.3.7.3 Time Varying Filter
      8. 7.3.8 JESD204C Interface
        1. 7.3.8.1 Transport Layer
        2. 7.3.8.2 Scrambler
        3. 7.3.8.3 Link Layer
        4. 7.3.8.4 8B/10B Link Layer
          1. 7.3.8.4.1 Data Encoding (8B/10B)
          2. 7.3.8.4.2 Multiframes and the Local Multiframe Clock (LMFC)
          3. 7.3.8.4.3 Code Group Synchronization (CGS)
          4. 7.3.8.4.4 Initial Lane Alignment Sequence (ILAS)
          5. 7.3.8.4.5 Frame and Multiframe Monitoring
        5. 7.3.8.5 64B/66B Link Layer
          1. 7.3.8.5.1 64B/66B Encoding
          2. 7.3.8.5.2 Multiblocks, Extended Multiblocks and the Local Extended Multiblock Clock (LEMC)
          3. 7.3.8.5.3 Block, Multiblock and Extended Multiblock Alignment using Sync Header
            1. 7.3.8.5.3.1 Cyclic Redundancy Check (CRC) Mode
            2. 7.3.8.5.3.2 Forward Error Correction (FEC) Mode
          4. 7.3.8.5.4 Initial Lane Alignment
          5. 7.3.8.5.5 Block, Multiblock and Extended Multiblock Alignment Monitoring
        6. 7.3.8.6 Physical Layer
          1. 7.3.8.6.1 SerDes Pre-Emphasis
        7. 7.3.8.7 JESD204C Enable
        8. 7.3.8.8 Multi-Device Synchronization and Deterministic Latency
        9. 7.3.8.9 Operation in Subclass 0 Systems
      9. 7.3.9 Alarm Monitoring
        1. 7.3.9.1 Clock Upset Detection
        2. 7.3.9.2 FIFO Upset Detection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Dual-Channel Mode
      2. 7.4.2 Single-Channel Mode (DES Mode)
      3. 7.4.3 Dual-Input Single-Channel Mode (DUAL DES Mode)
      4. 7.4.4 JESD204C Modes
        1. 7.4.4.1 JESD204C Operating Modes Table
        2. 7.4.4.2 JESD204C Modes continued
        3. 7.4.4.3 JESD204C Transport Layer Data Formats
        4. 7.4.4.4 64B/66B Sync Header Stream Configuration
      5. 7.4.5 Power-Down Modes
      6. 7.4.6 Test Modes
        1. 7.4.6.1 Serializer Test-Mode Details
        2. 7.4.6.2 PRBS Test Modes
        3. 7.4.6.3 Clock Pattern Mode
        4. 7.4.6.4 Ramp Test Mode
        5. 7.4.6.5 Short and Long Transport Test Mode
          1. 7.4.6.5.1 Short Transport Test Pattern
        6. 7.4.6.6 D21.5 Test Mode
        7. 7.4.6.7 K28.5 Test Mode
        8. 7.4.6.8 Repeated ILA Test Mode
        9. 7.4.6.9 Modified RPAT Test Mode
      7. 7.4.7 Calibration Modes and Trimming
        1. 7.4.7.1 Foreground Calibration Mode
        2. 7.4.7.2 Background Calibration Mode
        3. 7.4.7.3 Low-Power Background Calibration (LPBG) Mode
      8. 7.4.8 Offset Calibration
      9. 7.4.9 Trimming
    5. 7.5 Programming
      1. 7.5.1 Using the Serial Interface
        1. 7.5.1.1 SCS
        2. 7.5.1.2 SCLK
        3. 7.5.1.3 SDI
        4. 7.5.1.4 SDO
        5. 7.5.1.5 Streaming Mode
    6. 7.6 SPI Register Map
  8. Application Information Disclaimer
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Reconfigurable Dual-Channel 5-GSPS or Single-Channel 10-Gsps Oscilloscope
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Input Signal Path
          2. 8.2.1.1.2 Clocking
          3. 8.2.1.1.3 ADC08DJ5200RF
    3. 8.3 Initialization Set Up
  9. Power Supply Recommendations
    1. 9.1 Power Sequencing
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 123
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 术语表
  12. 12Mechanical, Packaging, and Orderable Information
SYSREF Position Detector and Sampling Position Selection (SYSREF Windowing)

The SYSREF windowing block is used to first detect the position of SYSREF relative to the CLK± rising edge and then to select a desired SYSREF sampling instance, which is a delay version of CLK±, to maximize setup and hold timing margins. In many cases a single SYSREF sampling position (SYSREF_SEL) is sufficient to meet timing for all systems (device-to-device variation) and conditions (temperature and voltage variations). However, this feature can also be used by the system to expand the timing window by tracking the movement of SYSREF as operating conditions change or to remove system-to-system variation at production test by finding a unique optimal value at nominal conditions for each system.

This section describes proper usage of the SYSREF windowing block. First, apply the device clock and SYSREF to the device. The location of SYSREF relative to the device clock cycle is determined and stored in the SYSREF_POS bits of the SYSREF capture position register. ADC08DJ5200RF must see at least 3 rising edges of SYSREF before the SYSREF_POS output is valid. Each bit of SYSREF_POS represents a potential SYSREF sampling position. If a bit in SYSREF_POS is set to 1, then the corresponding SYSREF sampling position has a potential setup or hold violation. Upon determining the valid SYSREF sampling positions (the positions of SYSREF_POS that are set to 0) the desired sampling position can be chosen by setting SYSREF_SEL in the clock control register 0 to the value corresponding to that SYSREF_POS position. In general, the middle sampling position between two setup and hold instances is chosen. Ideally, SYSREF_POS and SYSREF_SEL are performed at the nominal operating conditions of the system (temperature and supply voltage) to provide maximum margin for operating condition variations. This process can be performed at final test and the optimal SYSREF_SEL setting can be stored for use at every system power up. Further, SYSREF_POS can be used to characterize the skew between CLK± and SYSREF± over operating conditions for a system by sweeping the system temperature and supply voltages. For systems that have large variations in CLK± to SYSREF± skew, this characterization can be used to track the optimal SYSREF sampling position as system operating conditions change. In general, a single value can be found that meets timing over all conditions for well-matched systems, such as those where CLK± and SYSREF± come from a single clocking device.

Note:

SYSREF_SEL must be set to 0 when using automatic SYSREF calibration; see the Automatic SYSREF Calibration section.

The step size between each SYSREF_POS sampling position can be adjusted using SYSREF_ZOOM. When SYSREF_ZOOM is set to 0, the delay steps are coarser. When SYSREF_ZOOM is set to 1, the delay steps are finer. See the Switching Characteristiccs table for delay step sizes when SYSREF_ZOOM is enabled and disabled. In general, SYSREF_ZOOM = 1 is recommended to be used above fCLK = 3GHz and SYSREF_ZOOM = 0 below fCLK = 3GHz. Bits 0 and 23 of SYSREF_POS are always be set to 1 because there is insufficient information to determine if these settings are close to a timing violation, although the actual valid window can extend beyond these sampling positions. The value programmed into SYSREF_SEL is the decimal number representing the desired bit location in SYSREF_POS. Table 7-6 lists some example SYSREF_POS readings and the optimal SYSREF_SEL settings. Although 24 sampling positions are provided by the SYSREF_POS status register, SYSREF_SEL only allows selection of the first 16 sampling positions, corresponding to SYSREF_POS bits 0 to 15. The additional SYSREF_POS status bits are intended only to provide additional knowledge of the SYSREF valid window. In general, lower values of SYSREF_SEL are selected because of delay variation over supply voltage, however in the fourth example a value of 15 provides additional margin and can be selected instead.

Table 7-6 Examples of SYSREF_POS Readings and SYSREF_SEL Selections
SYSREF_POS[23:0]OPTIMAL SYSREF_SEL SETTING
0x02E[7:0]
(Largest Delay)
0x02D[7:0](1)0x02C[7:0](1)
(Smallest Delay)
b10000000b01100000b000110018 or 9
b10011000b00000000b0011000112
b10000000b01100000b000000016 or 7
b10000000b00000011b000000014 or 15
b10001100b01100011b000110016
Red coloration indicates the bits that are selected, as given in the last column of this table.