ZHCSG14D October   2015  – October 2017 LMK61A2-100M , LMK61A2-125M , LMK61A2-156M , LMK61A2-312M , LMK61A2-644M , LMK61E0-050M , LMK61E0-155M , LMK61E0-156M , LMK61E2-100M , LMK61E2-125M , LMK61E2-156M , LMK61E2-312M , LMK61I2-100M

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      引脚分配
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - Power Supply
    6. 6.6  LVPECL Output Characteristics
    7. 6.7  LVDS Output Characteristics
    8. 6.8  HCSL Output Characteristics
    9. 6.9  OE Input Characteristics
    10. 6.10 Frequency Tolerance Characteristics
    11. 6.11 Power-On/Reset Characteristics (VDD)
    12. 6.12 PSRR Characteristics
    13. 6.13 PLL Clock Output Jitter Characteristics
    14. 6.14 Typical 156.25-MHz Output Phase Noise Characteristics
    15. 6.15 Additional Reliability and Qualification
    16. 6.16 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 Device Output Configurations
  8. Power Supply Recommendations
  9. Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Ensuring Thermal Reliability
      2. 9.1.2 Best Practices for Signal Integrity
      3. 9.1.3 Recommended Solder Reflow Profile
  10. 10器件和文档支持
    1. 10.1 相关链接
    2. 10.2 接收文档更新通知
    3. 10.3 社区资源
    4. 10.4 商标
    5. 10.5 静电放电警告
    6. 10.6 Glossary
  11. 11机械、封装和可订购信息

Ensuring Thermal Reliability

The LMK61XX is a high performance device. Therefore, pay careful attention to device configuration and printed-circuit board (PCB) layout with respect to power consumption. The ground pin needs to be connected to the ground plane of the PCB through three vias or more, as shown in Figure 18, to maximize thermal dissipation out of the package.

Equation 1 describes the relationship between the PCB temperature around the LMK61XX and its junction temperature.

Equation 1. TB = TJ – ΨJB × P

where

  • TB: PCB temperature around the LMK61XX
  • TJ: Junction temperature of LMK61XX
  • ΨJB: Junction-to-board thermal resistance parameter of LMK61XX (37.7°C/W without airflow)
  • P: On-chip power dissipation of LMK61XX

To ensure that the maximum junction temperature of LMK61X2 is below 125°C, the maximum PCB temperature without airflow should be at 99°C or below (89°C or below for LMK61X0) when the device is optimized for best performance resulting in maximum on-chip power dissipation of 0.68 W.