ZHCSFJ8 September   2016 ISO5451-Q1

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. 说明 (续)
  6. Pin Configuration and Function
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Rating
    6. 7.6  Insulation Characteristics
    7. 7.7  Safety Limiting Values
    8. 7.8  Safety-Related Certifications
    9. 7.9  Electrical Characteristics
    10. 7.10 Switching Characteristics
    11. 7.11 Safety and Insulation Characteristics Curves
    12. 7.12 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Supply and active Miller clamp
      2. 9.3.2 Active Output Pull-down
      3. 9.3.3 Undervoltage Lockout (UVLO) with Ready (RDY) Pin Indication Output
      4. 9.3.4 Fault (FLT) and Reset (RST)
      5. 9.3.5 Short Circuit Clamp
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1  Recommended ISO5451-Q1 Application Circuit
        2. 10.2.2.2  FLT and RDY Pin Circuitry
        3. 10.2.2.3  Driving the Control Inputs
        4. 10.2.2.4  Local Shutdown and Reset
        5. 10.2.2.5  Global-Shutdown and Reset
        6. 10.2.2.6  Auto-Reset
        7. 10.2.2.7  DESAT Pin Protection
        8. 10.2.2.8  DESAT Diode and DESAT Threshold
        9. 10.2.2.9  Determining the Maximum Available, Dynamic Output Power, POD-max
        10. 10.2.2.10 Example
        11. 10.2.2.11 Higher Output Current Using an External Current Buffer
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 PCB Material
    3. 12.3 Layout Example
  13. 13器件和文档支持
    1. 13.1 文档支持
      1. 13.1.1 相关文档 
    2. 13.2 接收文档更新通知
    3. 13.3 社区资源
    4. 13.4 商标
    5. 13.5 静电放电警告
    6. 13.6 Glossary
  14. 14机械、封装和可订购信息

说明 (续)

当发生去饱和故障时,器件会通过隔离隔栅发送故障信号,以将输入端的 FLT 输出拉为低电平并阻断隔离器的输入。FLT 的输出状态将被锁存,可通过 RST 输入上的低电平有效脉冲复位。

如果在由双极输出电源供电的正常运行期间关断 IGBT,输出电压会被硬钳位为 VEE2。如果输出电源为单极,那么可采用有源米勒钳位,这种钳位会在一条低阻抗路径上灌入米勒电流,从而防止 IGBT 在高电压瞬态条件下发生动态导通。

栅极驱动器是否准备就绪待运行由两个欠压锁定电路控制,这两个电路会监视输入端和输出端的电源。如果任意一端电源不足,RDY 输出会变为低电平,否则该输出为高电平。

ISO5451-Q1 采用 16 引脚小外形尺寸集成电路 (SOIC) 封装。此器件的额定工作环境温度范围为 -40°C 至 125°C。