ZHCSDS7A May   2015  – June 2015 LDC1101

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 简化电路原理图
  5. 5 修订历史记录
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Digital Interface
    7. 7.7 Timing Requirements
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Sensor Driver
    4. 8.4 Device Functional Modes
      1. 8.4.1 Measurement Modes
      2. 8.4.2 RP+L Measurement Mode
        1. 8.4.2.1 RPMIN and RPMAX
        2. 8.4.2.2 Programmable Internal Time Constants
        3. 8.4.2.3 RP+L Mode Measurement Sample Rate
      3. 8.4.3 High Resolution L (LHR) Measurement Mode
      4. 8.4.4 Reference Count Setting
      5. 8.4.5 L-Only Measurement Operation
      6. 8.4.6 Minimum Sensor Frequency and Watchdog Setting
      7. 8.4.7 Low Power Modes
        1. 8.4.7.1 Shutdown Mode
        2. 8.4.7.2 Sleep Mode
      8. 8.4.8 Status Reporting
      9. 8.4.9 Switch Functionality and INTB Reporting
    5. 8.5 Programming
      1. 8.5.1 SPI Programming
    6. 8.6 Register Maps
      1. 8.6.1  Individual Register Listings
      2. 8.6.2  Register RP_SET (address = 0x01) [reset = 0x07]
      3. 8.6.3  Register TC1 (address = 0x02) [reset = 0x90]
      4. 8.6.4  Register TC2 (address = 0x03) [reset = 0xA0]
      5. 8.6.5  Register DIG_CONF (address = 0x04) [reset = 0x03]
      6. 8.6.6  Register ALT_CONFIG (address = 0x05) [reset = 0x00]
      7. 8.6.7  Register RP_THRESH_HI_LSB (address = 0x06) [reset = 0x00]
      8. 8.6.8  Register RP_THRESH_HI_MSB (address = 0x07) [reset = 0x00]
      9. 8.6.9  Register RP_THRESH_LO_LSB (address = 0x08) [reset = 0x00]
      10. 8.6.10 Register RP_THRESH_LO_MSB (address = 0x09) [reset = 0x00]
      11. 8.6.11 Register INTB_MODE (address = 0x0A) [reset = 0x00]
      12. 8.6.12 9.Register START_CONFIG (address = 0x0B) [reset = 0x01]
      13. 8.6.13 Register D_CONFIG (address = 0x0C) [reset = 0x00]
      14. 8.6.14 Register L_THRESH_HI_LSB (address = 0x16) [reset = 0x00]
      15. 8.6.15 Register L_THRESH_HI_MSB (address = 0x17) [reset = 0x00]
      16. 8.6.16 Register L_THRESH_LO_LSB (address = 0x18) [reset = 0x00]
      17. 8.6.17 Register L_THRESH_LO_MSB (address = 0x19) [reset = 0x00]
      18. 8.6.18 Register STATUS (address = 0x020 [reset = 0x00]
      19. 8.6.19 Register RP_DATA_LSB (address = 0x21) [reset = 0x00]
      20. 8.6.20 Register RP_DATA_MSB (address = 0x22) [reset = 0x00]
      21. 8.6.21 Register L_DATA_LSB (address = 0x23) [reset = 0x00]
      22. 8.6.22 Register L_DATA_MSB (address = 0x24) [reset = 0x00]
      23. 8.6.23 Register LHR_RCOUNT_LSB (address = 0x30) [reset = 0x00]
      24. 8.6.24 Register LHR_RCOUNT_MSB (address = 0x31) [reset = 0x00]
      25. 8.6.25 Register LHR_OFFSET_LSB (address = 0x32) [reset = 0x00]
      26. 8.6.26 Register LHR_OFFSET_MSB (address = 0x33) [reset = 0x00]
      27. 8.6.27 Register LHR_CONFIG (address = 0x34) [reset = 0x00]
      28. 8.6.28 Register LHR_DATA_LSB (address = 0x38) [reset = 0x00]
      29. 8.6.29 Register LHR_DATA_MID (address = 0x39) [reset = 0x00]
      30. 8.6.30 Register LHR_DATA_MSB (address = 0x3A) [reset = 0x00]
      31. 8.6.31 Register LHR_STATUS (address = 0x3B) [reset = 0x00]
      32. 8.6.32 Register RID (address = 0x3E) [reset = 0x02]
      33. 8.6.33 Register DEVICE_ID (address = 0x3F) [reset = 0xD4]
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1  Theory of Operation
      2. 9.1.2  RP+L Mode Calculations
      3. 9.1.3  LDC1101 RP Configuration
      4. 9.1.4  Setting Internal Time Constant 1
      5. 9.1.5  Setting Internal Time Constant 2
      6. 9.1.6  MIN_FREQ and Watchdog Configuration
      7. 9.1.7  RP+L Sample Rate Configuration with RESP_TIME
      8. 9.1.8  High Resolution Inductance Calculation (LHR mode)
      9. 9.1.9  LHR Sample Rate Configuration with RCOUNT
      10. 9.1.10 Setting RPMIN for LHR Measurements
      11. 9.1.11 Sensor Input Divider
      12. 9.1.12 Reference Clock Input
      13. 9.1.13 INTB Reporting on SDO
      14. 9.1.14 DRDY (Data Ready) Reporting on SDO
      15. 9.1.15 Comparator Functionality
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Device Configuration for RP+L Measurement with an Example Sensor
        2. 9.2.2.2 Device Configuration for LHR Measurement with an Example Sensor
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Ground and Power Planes
      2. 11.1.2 CLKIN Routing
      3. 11.1.3 Capacitor Placement
      4. 11.1.4 Sensor Connections
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 开发支持
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13机械、封装和可订购信息

12 器件和文档支持

12.1 器件支持

12.1.1 开发支持

要获取在线 LDC 系统设计工具，请访问德州仪器的 Webench® 工具

LDC 计算器工具提供了一系列在 MS Excel® 下运行的计算工具，这些工具对于 LDC 的系统开发非常有用。

12.2 文档支持

12.2.1 相关文档

有关 LDC 传感器设计的详细信息，请参见《LDC 传感器设计应用报告》（文献编号：SNOA930）。

有关使用 LDC 进行横向位置感测（其中目标点移动时与传感器保持一定高度的距离，然后测量偏差）的详细信息，请参见《LDC1612/LDC1614 线性位置感测》（文献编号：SNOA931）。 LDC1101 LHR 模式的功能相当于单通道 LDC1612/LDC1614。

有关温度补偿的信息，请参见《LDC1000 温度补偿》（文献编号：SNAA212）。

12.3 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.4 商标

E2E is a trademark of Texas Instruments.

Webench is a registered trademark of Texas Instruments.

Excel is a registered trademark of Microsoft Corporation.

SPI is a trademark of Motorola.

All other trademarks are the property of their respective owners.

12.5 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

12.6 术语表

SLYZ022 — TI 术语表。

这份术语表列出并解释术语、首字母缩略词和定义。