TIDT299 September   2022

 

  1.   Description
  2.   Features
  3.   Applications
  4. 1Test Prerequisites
    1. 1.1 Design Requirements
    2. 1.2 Required Equipment
    3. 1.3 Considerations
    4. 1.4 Dimensions
  5. 2Testing and Results
    1. 2.1 Efficiency Graphs
    2. 2.2 Efficiency Data
    3. 2.3 Thermal Images
    4. 2.4 Thermal Efficiency Data
    5. 2.5 Frequency Response
  6. 3Waveforms
    1. 3.1 Switching
    2. 3.2 Output Voltage Ripple
    3. 3.3 Load Transients
    4. 3.4 Start-Up Sequence
    5. 3.5 Bypass Operation

1.4 Dimensions

The design was built on PMP7850 Rev. B printed circuit board. This is a 4-layer PCB with 1-oz copper on all layers. Board dimensions are 4.0 in × 3.0 in.