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  • Migration Between TMS320F28004x and TMS320F28003x

    • SPRUIW3 October   2021 TMS320F280033 , TMS320F280034 , TMS320F280034-Q1 , TMS320F280036-Q1 , TMS320F280036C-Q1 , TMS320F280037 , TMS320F280037-Q1 , TMS320F280037C , TMS320F280037C-Q1 , TMS320F280038-Q1 , TMS320F280038C-Q1 , TMS320F280039 , TMS320F280039-Q1 , TMS320F280039C , TMS320F280039C-Q1 , TMS320F280040-Q1 , TMS320F280040C-Q1 , TMS320F280041 , TMS320F280041-Q1 , TMS320F280041C , TMS320F280041C-Q1 , TMS320F280045 , TMS320F280048-Q1 , TMS320F280048C-Q1 , TMS320F280049 , TMS320F280049-Q1 , TMS320F280049C , TMS320F280049C-Q1

       

  • CONTENTS
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  • Migration Between TMS320F28004x and TMS320F28003x
  1.   Trademarks
  2. 1Feature Differences Between F28004x and F28003x
    1. 1.1 F28004x and F28003x Feature Comparison
  3. 2PCB Hardware Changes
    1. 2.1 PCB Hardware Changes for the 100-Pin PZ Package
      1. 2.1.1 100-Pin PZ Migration for Existing PCB
      2. 2.1.2 100-Pin PZ Migration for New PCB Design
    2. 2.2 PCB Hardware Changes for the 64-Pin PM Package
      1. 2.2.1 64-Pin PM Migration for New and Existing PCB
  4. 3Feature Differences for System Consideration
    1. 3.1 New Features in F28003x
      1. 3.1.1  TMU Type1
      2. 3.1.2  Fast Integer Division (FINTDIV)
      3. 3.1.3  Host Interface Controller (HIC)
      4. 3.1.4  Background CRC (BGCRC)
      5. 3.1.5  Standby Low Power Mode
      6. 3.1.6  X1 GPIO Functionality
      7. 3.1.7  Diagnostic Features (PBIST/HWBIST)
      8. 3.1.8  Advance Encryption Standard (AES)
      9. 3.1.9  Secure Boot/JTAG Lock
      10. 3.1.10 Modular Controller Area Network (MCAN)
      11. 3.1.11 Embedded Pattern Generator (EPG)
      12. 3.1.12 Live Firmware Update (LFU)
    2. 3.2 Communication Module Changes
    3. 3.3 Control Module Changes
    4. 3.4 Analog Module Differences
    5. 3.5 Other Device Changes
      1. 3.5.1 XTAL Module
      2. 3.5.2 PLL
      3. 3.5.3 PIE Channel Mapping
      4. 3.5.4 Bootrom
      5. 3.5.5 CLB and Motor Control Libraries
      6. 3.5.6 ERAD
      7. 3.5.7 GPIO
      8. 3.5.8 AGPIO
      9. 3.5.9 ERROR Status
    6. 3.6 Power Management
      1. 3.6.1 LDO/VREG
      2. 3.6.2 DCDC
      3. 3.6.3 POR/BOR
      4. 3.6.4 Power Consumption
    7. 3.7 Memory Module Changes
    8. 3.8 GPIO Multiplexing Changes
    9. 3.9 Analog Multiplexing Changes
  5. 4Application Code Migration From F28004x to F28003x
    1. 4.1 C2000Ware Header Files
    2. 4.2 Linker Command Files
    3. 4.3 Minimum Compiler Version Requirement for TMU Type 1
    4. 4.4 C2000Ware Examples
  6. 5Specific Use Cases Related to F28003x New Features
    1. 5.1 HIC
    2. 5.2 FINTDIV
    3. 5.3 TMU Type1
    4. 5.4 AES
    5. 5.5 MCAN
    6. 5.6 EPG
  7. 6EABI Support
    1. 6.1 Flash API
    2. 6.2 NoINIT Struct Fix (Linker Command)
    3. 6.3 Pre-Compiled Libraries
  8. 7References
  9. IMPORTANT NOTICE
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USER'S GUIDE

Migration Between TMS320F28004x and TMS320F28003x

Trademarks

C2000 and Code Composer Studio are trademarks of Texas Instruments.

All trademarks are the property of their respective owners.

1 Feature Differences Between F28004x and F28003x

F28003x is both a subset and superset of F28004x. They have two packages in common, 64-pin and 100-pin. It is possible to migrate between F28003x and F28004x with the caveats in this document taken into account.

Note: This comparison guide focuses on the superset devices: F280049 and F280039. Other part numbers in this product family have reduced feature support. For details specific to part numbers, see the device-specific data sheet.

1.1 F28004x and F28003x Feature Comparison

An overlaid block diagram of F28004x and F28003x is shown in Figure 1-1 while feature comparison of the superset part numbers for the F28003x and F28004x devices is shown in Table 1-1.

GUID-20201014-CA0I-6XSW-ZSQM-JZMDWK3BX0QW-low.gif Figure 1-1 F28003x and F28004x Overlaid Functional Block Diagram

Table 1-1 F28004x and F28003x Superset Device Comparison
Feature F28004x F28003x
100-Pin PZ 64-Pin PM 56-Pin RSH 100-Pin PZ 80-Pin PN 64-Pin PM 48-Pin PT
Processor and Accelerators
C28x Frequency (MHz) 100 120
FPU Yes Yes (instructions for Fast Integer Division)
VCU–I Yes –
VCRC – Yes
TMU Yes – Type 0 Yes – Type 1 (instructions supporting NLPID)
CLA – Type 2 Available Yes
Frequency (MHz) 100 120
6–Channel DMA – Type 0 Yes
External interrupts 5
Memory
Flash 256KB (128Kw) 384KB (192Kw)
RAM Dedicated 4KB (2Kw)
Local Shared 32KB (16Kw)
Message 0.5KB (0.25Kw) 1KB (0.5Kw)
Global Shared 64KB (32Kw) 32KB (16Kw)
Total 100.5KB (50.25Kw) 69KB (34.5Kw)
Message RAM Types 512B (256w) CPU–CLA 512B (256w) CPU–CLA 512B (256w) CLA–DMA
ECC FLASH, Mx FLASH, Mx, LSx, GSx, Message RAM
Parity LSx, GSx, Message RAM, CAN RAM ROM, CAN RAM
Code security for on–chip flash and RAM Yes
System
Configurable Logic Block (CLB) 4 Tiles – Type 2 4 Tiles – Type 3
Embedded Pattern Generator (EPG) - Yes
Motor Control Libraries in ROM Yes
32–bit CPU timers 3
Advance Encryption Standard (AES) – Yes
Background CRC (BGCRC) – Yes
Live Firmware Update (LFU) Support Yes Yes, with enhancements and flash bank erase time improvements
Secure Boot – Yes
JTAG Lock – Yes
HWBIST – Yes
Nonmaskable Interrupt Watchdog (NMIWD) timers 1
Watchdog timers 1
Crystal oscillator/External clock input 1
Internal oscillator 2
Pins and Power Supply
Internal 3.3v to 1.2v Voltage Regulator VREG LDO Yes
DCDC Yes –
GPIO pins 35 21 20 51 39 26 14
Additional GPIO 5 (2 from cJTAG, 1 from X2 and 2 from DCDC) 4 (2 from cJTAG and 2 from X1/X2)
AIO (analog with digital inputs) 21 14 12 23 16 16 14
AGPIO (analog with digital inputs and outputs) - 2 2 - -
Analog Peripherals
ADC 12–bit Number of ADCs 3
MSPS 3.45 4
Conversion Time (ns) 290 250
ADC channels (single–ended) - includes the two gpdac outputs 21 14 12 23 18 16 14
Temperature sensor 1
Buffered DAC 2
CMPSS (each CMPSS has two comparators and two internal DACs) 7 6 5 4
PGA (Gain Settings: 3, 6, 12, 24) 7 5 4 –
Control Peripherals
eCAP/HRCAP modules 7 (2 with HRCAP capability) – Type 1 3 (1 with HRCAP capability) – Type 2
ePWM/HRPWM channels – Type 4 16 (16 with HRPWM) 16 (8 with HRPWM)
eQEP modules 2 – Type 1 1 – Type 1 2 – Type 2
SDFM channels 4 – Type 1 3 – Type 1 8 – Type 2
Communication Peripherals
CAN (DCAN) – Type 0 2 1
CANFD (MCAN) – Type 2 – 1
FSI 1 (1 RX and 1 TX) – Type 0 1 (1 RX and 1 TX) – Type 2
I2C – Type 1 1 2
LIN – Type 1 1 2
HIC - Type 1 No Yes
PMBus – Type 0 1
SCI – Type 0 2
SPI – Type 2 2
Package Options, Temperature, and Qualification
Junction temperature (TJ) –40°C to 125°C –40°C to 150°C
Free-Air temperature (TA) –40°C to 125°C
Package Options with AEC-Q100 Qualification available Yes Yes – Yes – Yes Yes

2 PCB Hardware Changes

The F28004x and F28003x devices have two packages in common: 100-Pin PZ and 64-Pin PM. There are two kinds of migration that can happen between the two devices:

  • PCB is already designed for one device but you would like to swap in another device.
  • PCB is yet to be designed but you would like to start with one device and migrate later.

For the second migration type above, the dual-routing technique maximizes pin utilization. The following sections describe the pin migration in detail.

Note: Overall compatibility depends on more than just the pins. Please review all the changes in this document during the migration process.

2.1 PCB Hardware Changes for the 100-Pin PZ Package

This section describes the F28003x and F28004x differences that exist between the 100-Pin PZ package. The Q and non-Q variant of the 100-Pin PZ package have the same pinout per device. Figure 2-1 outlines the differences.

Figure 2-1 100-Pin PZ, F28003x and F28004x Pin-Overlay .

2.1.1 100-Pin PZ Migration for Existing PCB

If the PCB is already designed and you are moving from F28004x/F28003x to F28003x/F28004x respectively, dual routing is not possible and hence those pins become incompatible between the two devices, Table 2-1 outlines the migration.

For the color legend, see Figure 2-1.

Table 2-1 100-Pin PZ Migration Between F28004x and F28003x For Existing PCB
Pin No Pin Name Transition Type Action
F28004x F28003x F28003x to F28004x F28004x to F28003x
Minor Incompatibility - Signals in Common (1)
28 PGA6_IN, C5 C5, A12 Common Analog Channel Use C5
31 PGA4_IN, C3 C3, A7 Use C3
36 A4, B8, PGA2_OF A4, B8 Use A4 or B8
37 A8, PGA6_OF A8 Use A8
39 B4, C8, PGA4_OF B4, C8 Use B4 or C8
40 A10, B1, C10, PGA7_OF A10, B1, C10 Use A10, B1 or C10
21 C2 C2, B12 Use C2
22 A1, DACB_OUT A1, DACB_OUT, B7 Use A1 or DACB_OUT
41 B0 B0, C11 Use B0
69 X1 GPIO19, X1 Common Clock GPIO19 not available for use
81 GPIO23_VSW GPIO23 Common GPIO Do not use DCDC. GPIO22 & GPIO23 available for use
83 GPIO22_VFBSW GPIO22
Medium Incompatibility - Different Signals, Same Type
17 C4 A2, B6, C9 Analog Function Compatible Update code to C4 Update code to A2, B6 or C9
19 C0 A14, B14, C4 Update code to C0 Update code to A14, B14 or C4
85 GPIO40 GPIO44 GPIO Function Compatible Update code to GPIO40 Update code to GPIO44
91 GPIO39 GPIO61 Update code to GPIO39 Update code to GPIO61
Major Incompatibility - Different Signals and Types
14 PGA1_GND A6 PGA Ground to ADC Channel Do not use, follow the guidelines for unused pins in the datasheet as applicable
15 PGA3_GND B2, C6
32 PGA6_GND, PGA2_GND, PGA4_GND B5
42 PGA7_GND C14
13 PGA5_GND GPIO54 PGA Ground to GPIO
12 VSSA GPIO53 Ground to GPIO
82 VSS_SW GPIO41
11 VDDA GPIO52 Power to GPIO
80 VDDIO_SW GPIO40
16 PGA5_IN B3, VDAC PGA Input to ADC Channel
18 PGA1_IN C7, B9, A3
20 PGA3_IN A11, B10, C0
30 PGA2_IN B11
43 PGA7_IN GPIO55 PGA Input to GPIO
6 A6, PGA5_OF GPIO47 Analog to GPIO
7 B2, C6, PGA3_OF GPIO48
8 B3, VDAC GPIO49
9 A2, B6, PGA1_OF GPIO50
10 A3 GPIO51
44 C14 GPIO60
48 FLT2 GPIO20, B5 Flash Test Pins to GPIO/Analog
49 FLT1 GPIO21, B11
  1. Channel to use selected in software.

2.1.2 100-Pin PZ Migration for New PCB Design

If the PCB is yet to be designed and you are moving from F28004x/F28003x to F28003x/F28004x, respectively, the dual routing technique illustrated in Figure 2-2 maximizes pin utilization. The complete pin migration is outlined in Table 2-2.

GUID-20201016-CA0I-WFMR-R0PV-BDKVBSRVGPMW-low.gif Figure 2-2 Dual Routing Technique Illustrated

For the color legend, see Figure 2-1.

Table 2-2 100-Pin PZ Migration Between F28004x and F28003x For New PCB Design
Pin No Pin Name Transition Type Action
F28004x F28003x F28003x to F28004x F28004x to F28003x
Minor Incompatibility - Signals in Common (1)
28 PGA6_IN, C5 C5, A12 Common Analog Channel Use C5
31 PGA4_IN, C3 C3, A7 Use C3
36 A4, B8, PGA2_OF A4, B8 Use A4 or B8
37 A8, PGA6_OF A8 Use A8
39 B4, C8, PGA4_OF B4, C8 Use B4 or C8
40 A10, B1, C10, PGA7_OF A10, B1, C10 Use A10, B1 or C10
21 C2 C2, B12 Use C2
22 A1, DACB_OUT A1, DACB_OUT, B7 Use A1 or DACB_OUT
41 B0 B0, C11 Use B0
69 X1 GPIO19, X1 Common Clock GPIO19 not available for use
81 GPIO23_VSW GPIO23 Common GPIO Do not use DCDC. GPIO22 & GPIO23 available for use
83 GPIO22_VFBSW GPIO22
Medium Incompatibility - Different Signals, Same Type
19 C0 A14, B14, C4 Analog Function Compatible Update code to C0 Update code to A14, B14 or C4
85 GPIO40 GPIO44 GPIO Function Compatible Update code to GPIO40 Update code to GPIO44
91 GPIO39 GPIO61 Update code to GPIO39 Update code to GPIO61
Medium Incompatibility - Dual Routing
6 A6, PGA5_OF GPIO47 Dual PCB Route, F28004x 0-Ohm Resistor, F28003x DNP Dual route to Pin 6 & 14
7 B2, C6, PGA3_OF GPIO48 Dual route to Pin 7 & 15
8 B3, VDAC GPIO49 Dual route to Pin 8 & 16
9 A2, B6, PGA1_OF GPIO50 Dual route to Pin 9 & 17
10 A3 GPIO51 Dual route to Pin 10 & 18
14 PGA1_GND A6 Dual PCB Route, F28004x DNP, F28003x 0-Ohm Resistor Dual route to Pin 6 & 14
15 PGA3_GND B2, C6 Dual route to Pin 7 & 15
16 PGA5_IN B3, VDAC Dual route to Pin 8 & 16
17 C4 A2, B6, C9 Dual route to Pin 9 & 17
18 PGA1_IN C7, B9, A3 Dual route to Pin 10 & 18
Major Incompatibility - Different Signals and Types
32 PGA6_GND, PGA2_GND, PGA4_GND B5 PGA Ground to ADC Channel Tie to VSS
42 PGA7_GND C14
13 PGA5_GND GPIO54 PGA Ground to GPIO Tie to VSS through 0-Ohm resistor. Depopulate resistor when using F28003x and enable internal pull-up for the GPIOs
12 VSSA GPIO53 Ground to GPIO
82 VSS_SW GPIO41
11 VDDA GPIO52 Power to GPIO Tie to VDDIO through 0-Ohm resistor. Depopulate resistor when using F28003x and enable internal pull-up for the GPIOs
80 VDDIO_SW GPIO40
20 PGA3_IN A11, B10, C0 PGA Input to ADC Channel No connect. Enable internal pull-up for the GPIOs on F28003x
30 PGA2_IN B11
43 PGA7_IN GPIO55 PGA Input to GPIO
44 C14 GPIO60 Analog to GPIO
48 FLT2 GPIO20, B5 Flash Test Pins to GPIO
49 FLT1 GPIO21, B11
  1. Channel to use selected in software.

2.2 PCB Hardware Changes for the 64-Pin PM Package

This section describes the F28003x and F28004x differences that exist between the Q and non-Q variants of the 64-Pin PM package. Figure 2-3 shows the differences for the non-Q variant and Figure 2-4 shows the differences for the Q variant.

GUID-20201015-CA0I-NRQD-GBGL-DM0RJS4NCDG3-low.gif Figure 2-3 64-Pin PM Non-Q Variant, F28003x and F28004x Pin-Overlay.
GUID-20201015-CA0I-CJVJ-SPRL-5HWVBWCSHDLW-low.gif Figure 2-4 64-Pin PM Q Variant, F28003x and F28004x Pin-Overlay

2.2.1 64-Pin PM Migration for New and Existing PCB

Table 2-3 outlines the migration moving from F28004x/F28003x to F28003x/F28004x, respectively.

For the color legend, see Figure 2-3 and Figure 2-4.

Table 2-3 64-Pin PM Migration Between F28004x and F28003x For New and Existing PCB
Pin No Pin Name Transition Type Action
F28004x F28003x F28003x to F28004x F28004x to F28003x
Minor Incompatibility - Signals in Common (1)
6 A6, PGA5_OF A6 Common Analog Channel Use A6
7 B2, C6, PGA3_OF B2, C6 Use B2 or C6
8 B3, VDAC A3, B3, C5 VDAC Use B3 or VDAC
9 A2, B6, PGA1_OF A2, B6, C9 Use A2 or B6
11 PGA5_IN, C4 A14, B14, C4 Use C4
12 PGA1_IN, C0 A11, B10, C0 Use C0
13 PGA3_IN, C2 A5, B12, C2 Use C2
14 A1, DACB_OUT A1, B7, DACB_OUT Use A1 or DACB_OUT
18 C1 A12, C1 Use C1
19 PGA4_IN, C3 A7, C3 Use C3
23 C14 A4, B8, C14 Use C14
24 B4, C8 A9, B4, C8 Use B4 or C8
42 X1 GPIO19, X1 Common Clock GPIO19 not available for use
54 GPIO23_VSW GPIO23 Common GPIO Do not use DCDC. GPIO22 & GPIO23 available for use
56 GPIO22_VFBSW GPIO22
Major Incompatibility - Different Signals and Types
10 PGA1_GND, PGA3_GND, PGA5_GND A15, B9, C7 PGA Ground to ADC Channel Tie to VSS
20 PGA2_GND, PGA4_GND, PGA6_GND A8, B0, C11
55 VSS_SW GPIO41 Ground to GPIO Tie to VSS through 0-Ohm resistor. Depopulate resistor when using F28003x and enable internal pull-up for the GPIO
53 VDDIO_SW GPIO40 Power to GPIO Tie to VDDIO through 0-Ohm resistor. Depopulate resistor when using F28003x and enable internal pull-up for the GPIO
(Non-Q Variant) Major Incompatibility - Different Signals and Types
46 VREGENZ GPIO39 External VREG not supported. Tie to VSS through 0-Ω resistor. Depopulate resistor when using F28003x and enable internal pull-up for the GPIO
(Q Variant) Major Incompatibility - Different Signals and Types
29 FLT2 GPIO13 Flash Test Pins to GPIO No connect. Enable internal pull-up for the GPIOs on F28003x
30 FLT1 GPIO12
  1. Channel to use selected in software.

3 Feature Differences for System Consideration

The differences and similarities that exist when moving between the F28003x and F28004x devices is explored in this section.

3.1 New Features in F28003x

This section outlines features that only exist in the F28003x device. For details on each of these new features, see the TMS320F28003x Real-Time Microcontrollers Technical Reference Manual (SPRUIW9).

3.1.1 TMU Type1

Two instructions have been added to the instruction set of the Trigonometrical Math Unit (TMU) on F28003x to support computation of the floating-point power function “powf”. These instructions calculate the inverse binary exponent in base two logarithm and can be combined to compute the power of a floating-point number raised to the power of another floating-point number.

This calculation would typically take 300 cycles using library emulation, but takes less than ten cycles using the new instructions. An example of the application of the power function is non-linear proportional integral derivative control (NLPID), which is a component of the C2000 Digital Control Library found in C2000Ware.

3.1.2 Fast Integer Division (FINTDIV)

The C28x processor Fast Integer Division (FINTDIV) unit provides an open and scalable approach to facilitate different data type sizes (16/16, 32/16, 32/32, 64/32, 64/64), signed and unsigned or mixed data type versions (ui32/ui32, i32/ui32, i32/i32) and for additional performance, the operations return both the integer and remainder portion of the calculation simultaneously.

The division operations are interruptible so as to enable minimum latency for higher priority tasks, a critical requirement for high performance real-time control applications. Unique to this fast integer division unit is support for Truncated, Modulo and Euclidean division formats without any cycle penalty. Each of these formats represents the integer and remainder result in different forms. Below is a brief summary of the various division formats:

  • Truncated format is the traditional division performed in C language (/ = integer, % = remainder), however, the integer value is non-linear around zero.
  • Modulo division is commonly found when performing division on an Excel worksheet.
  • Euclidean format is another format similar to Modulo, the difference is the sign on the remainder value.

Both the Euclidean and Modulo formats are more appropriate for precise control applications because the integer value is linear around the zero point and, hence, avoid potential calculation hysteresis. The C28x compiler supports all three division formats for all data types.

3.1.3 Host Interface Controller (HIC)

The Host Interface Controller (HIC) is a new module for the F28003x device that allows an external host controller to directly access resources of the F28003x device using the ASRAM protocol. HIC was first introduced in F28002x.

3.1.4 Background CRC (BGCRC)

The Background CRC (BGCRC) is a new module for the F28003x device that can compute the CRC-32 value of a configurable block of memory. It is an upgrade on the CLAPROMCRC found in the F28004x device to test more memories than just the CLA ROM. BGCRC was first introduced in F2838x.

 

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