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  • OMAP-L13x/C674x/AM1x schematic review guidelines

    • SPRACK9 February   2019 AM1705 , AM1707 , AM1806 , AM1808 , OMAP-L132 , OMAP-L137 , OMAP-L138 , TMS320C6742 , TMS320C6745 , TMS320C6746 , TMS320C6747 , TMS320C6748

       

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  • OMAP-L13x/C674x/AM1x schematic review guidelines
  1.   OMAP-L13x/C674x/AM1x schematic review guidelines
    1.     Trademarks
    2. 1 Introduction
    3. 2 Recommendations Specific to OMAP-L1x/TMS320C674x/AM1x
      1. 2.1 EVM vs Data Sheet
      2. 2.2 Before You Begin
        1. 2.2.1 Documentation
        2. 2.2.2 Pinout
      3. 2.3 Critical Connections
        1. 2.3.1 Decoupling capacitors
        2. 2.3.2 Power
        3. 2.3.3 Ground
        4. 2.3.4 Clocking
        5. 2.3.5 Reset
        6. 2.3.6 Boot
        7. 2.3.7 Pin multiplexing
        8. 2.3.8 Debug
      4. 2.4 Peripherals
        1. 2.4.1 UART
        2. 2.4.2 EMAC
        3. 2.4.3 MMC/SD
        4. 2.4.4 EMIF
          1. 2.4.4.1 NAND
          2. 2.4.4.2 NOR
          3. 2.4.4.3 DDR2/mDDR
        5. 2.4.5 SPI
        6. 2.4.6 I2C
        7. 2.4.7 McASP
          1. 2.4.7.1 Audio
        8. 2.4.8 USB
          1. 2.4.8.1 USB0 (USB 2.0 OTG)
          2. 2.4.8.2 USB1 (USB 1.1 OHCI)
          3. 2.4.8.3 Unused USB pins
          4. 2.4.8.4 USB Board Design Guidelines
            1. 2.4.8.4.1 Cautionary note - USB PHY off while host is still powered on
        9. 2.4.9 Other
          1. 2.4.9.1 Signal Visibility
          2. 2.4.9.2 Voltage Level Changes
          3. 2.4.9.3 Signal Terminations
          4. 2.4.9.4 Ground Symbols
          5. 2.4.9.5 Power Symbols
    4. 3 BGA PCB Design
    5. 4 Power Management Solutions
    6. 5 References
  2.   A XDS Connector Design Checklist
    1.     A.1 XDS Connector Design
  3.   B Connecting NOR Flash to OMAP-L138
    1.     B.1 Connecting Memory Devices <32 MB
    2.     B.2 Connecting Memory Devices >32 MB
  4. IMPORTANT NOTICE
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APPLICATION NOTE

OMAP-L13x/C674x/AM1x schematic review guidelines

OMAP-L13x/C674x/AM1x schematic review guidelines

This application report provides schematic review guidelines for the OMAP-L1x, C6l4x, and AM1x families of TI System-on-Chips (SoCs).

Trademarks

C6000 is a registered trademark of Texas Instruments.

Arm9 is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.

All other trademarks are the property of their respective owners.

1 Introduction

This application report applies to the following devices:

  • OMAP-L138
  • OMAP-L137
  • TMS320C6748/TMS320C6746/TMS320C6742
  • TMS320C6747/TMS320C6745/TMS320C6743
  • AM1810/AM1808/AM1806/AM1802
  • AM1707/AM1705

For OMAP-L1x DSP + ARM9 based processors, refer to this link: OMAP-L1x based processors.

For C6000™ DSPs, refer to this link: C6x DSPs.

For Arm9™-based processors, refer to this link: ARM9 processors.

2 Recommendations Specific to OMAP-L1x/TMS320C674x/AM1x

2.1 EVM vs Data Sheet

In the event of discrepancies between the TI EVMs and the device-specific data sheet, always follow the data sheet. EVMs are often designed before the device has been fully characterized, and may contain errors which do not impact functionality on that particular board, but are not completely aligned with the data sheet specifications. Therefore, the EVMs should not be considered reference designs.

2.2 Before You Begin

2.2.1 Documentation

Make sure you have the latest version of documentation, especially the data sheet and silicon errata.

Tip: Try searching the documentation for words such as: "must," "require," "do not," "shall," "note," and so forth. Important criteria for the device will typically contain one or more of these words. This is an easy way to make sure you have not missed anything important.

Tip: On each ti.com device product folder, there is a button, "Alert me about changes to this product." Registering here enables proactive automatic notification of device errata.

2.2.2 Pinout

  • Have you verified that your pin labels correspond to the correct pin numbers?
  • Have you verified that the power pins are connected to the correct supply rails?
  • Pull-ups/pull-downs:
    • Internal pull-up/pull-down resistors are implemented with weak transistors. As the voltage present on the I/O pin varies, the relative gate voltage for this weak transistor changes, which will cause the effective pull-up/pull-down resistance to change. Therefore, internal resistors do not have a linear response like external resistors do. The non-linearity, along with process, voltage, and temperature variations, require internal pull-up/pull-down resistors to be specified with a wide range of resistance or current sourcing/sinking.
    • The input current without a pull-up or pull-down turned on defines the input leakage without any current from internal pull resistors. The input current with a pull-up or pull-down turned on defines a combination of input leakage current and current required to force the internal pull resistors to the opposite voltage rail. For example, if an internal pull-up is turned on, the value shown represents the total current required to pull the input to VSS.
    • When deciding what value of external resistor to use, you must consider the worst case combination of all internal leakage paths of all devices connected to a signal and make sure the external resistor is able to force these internal leakage paths to a potential greater than Vih min, or less than Vil max.

 
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