SNWS022D January   2010  – June 2015 LMH2110

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 2.7-V and 4.5-V DC and AC Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Accurate Power Measurement
      2. 7.3.2 Types of RF Detectors
        1. 7.3.2.1 Peak Detectors
        2. 7.3.2.2 LOG Amp Detectors
        3. 7.3.2.3 RMS Detectors
      3. 7.3.3 LMH2110 RF Power Detector
        1. 7.3.3.1 RF Input
        2. 7.3.3.2 Enable
        3. 7.3.3.3 Output
        4. 7.3.3.4 Supply
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Application With Transmit Power Control
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Specifying Detector Performance
            1. 8.2.1.2.1.1 Dynamic Range
            2. 8.2.1.2.1.2 Log Conformance Error
            3. 8.2.1.2.1.3 Variation Over Temperature Error
            4. 8.2.1.2.1.4 1-dB Step Error
            5. 8.2.1.2.1.5 10-dB Step Error
            6. 8.2.1.2.1.6 Variation Due to Modulation
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Application With Resistive Divider
      3. 8.2.3 Application With Low-Pass Output Filter for Residual Ripple Reduction
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

4 Revision History

Changes from C Revision (March 2013) to D Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from B Revision (October 2013) to C Revision

  • Changed layout of National Data Sheet to TI formatGo