SNAK005A June 2019 – April 2024 LMX2694-EP
A new device can be qualified either by performing a full scale quality and reliability test on the actual device or using previously qualified devices through Qualification by Similarity (QBS) rules. By establishing similarity between the new device and those previously qualified, repetitive tests are eliminated, allowing for timely production release. When adopting QBS methodology, the emphasis is on qualifying the differences between a previously qualified product and the new product under consideration. The QBS rules for a technology, product, test parameter, or package defines which attributes are required to remain fixed in order for the QBS rules to apply. The attributes that are expected and allowed to vary are reviewed and a QBS plan is developed, based on the reliability impact assessment above, specifying what subset of the full complement of environmental stresses is required to evaluate the reliability impact of those variations. Each new device is reviewed for the conformance to the QBS rule sets applicable to the device. See JEDEC JESD47 for more information.
| Device Baseline1 | ||||
|---|---|---|---|---|
| DLA VID | V62/19616 | Test Site | TI PHILIPPINES CLARK A/T | |
| Wafer Fab | Texas Instruments Deutschland- FFAB (Freising) | Pin/Package Type | VQFNP (RTC) | 48 | |
| Fab Process | BICMOS13 | Leadframe | Cu | |
| Fab Technology | CMOS | Termination Finish | NiPdAu-Ag | |
| Bond Wire | 25.4µm Au | Mount Compound | Hitachi EN-4900GC | |
| ESD CDM | ±1000V | Mold Compound | Sumitomo EME-G700E | |
| ESD HBM | ±1000V | Moisture Sensitivity | MSL 3 / 260°C | |
| Baseline information in effect as of the date of this report.1 | ||||
| Note that qualification by similarity (“qualification family”) per JEDEC JESD47 is allowed. | ||||
|---|---|---|---|---|
| Description | Condition | Sample Size Used/Rejects | Lots Required | Test Method |
| Electromigration | Maximum Recommended Operating Conditions | N/A | N/A | Per TI Design Rules |
| Wire Bond Life | Maximum Recommended Operating Conditions | N/A | N/A | Per TI Design Rules |
| Electrical Characterization | TI Data Sheet | 15 | 3 | N/A |
| Electrostatic Discharge Sensitivity | HBM | 3 units / voltage | N/A | EIA/JESD22-A114 |
| CDM | EIA/JESD22-C101 | |||
| Latch-up | Per Technology | 5/0 | 3 | EIA/JESD78 |
| Physical Dimensions | TI Data Sheet | 5/0 | 1 | EIA/JESD22- B100 |
| Thermal Impedance | Theta-JA on board | Per Pin-Package | N/A | EIA/JESD51 |
| Bias Life Test | 125°C / 1000 hours or equivalent | 45/0 | 3 | JESD22-A108* |
| Biased Humidity or Biased HAST |
85°C / 85% / 1000 hours or 130°C / 85% / 96 hours |
77/0 | 3 | JESD22-A101* JESD22-A110* |
| Extended Biased Humidity or Extended Biased HAST |
85°C / 85% / 2600 hours (for reference) or 130°C / 85% / 250 hours (for reference) |
77/0 | 1 | JESD22-A101* JESD22-A110* |
| Unbiased HAST | 130°C / 85% / 96 hours | 77/0 | 3 | JESD22-A.118* |
| Temperature Cycle | -65°C to +150 °C non-biased for 500 cycles | 77/0 | 3 | JESD22-A104* |
| Solder Heat | 260°C for 10 seconds | 22/0 | 1 | JESD22-B106 |
| Resistance to Solvents | Ink symbol only | 12/0 | 1 | JESD22-B107 |
| Solderability | Condition A (steam age for 8 hours) | 22/0 | 1 | ANSI/J-STD-002-92 |
| Flammability | Method A / Method B | 5/0 | 1 | UL-1964 |
| Bond Shear | Per wire size | 5 units × 30/0 bonds | 3 | JESD22-B116 |
| Bond Pull Strength | Per wire size | 5 units × 30/0 bonds | 3 | ASTM F-459 |
| Die Shear | Per die size | 5/0 | 3 | TM 2019 |
| High Temperature Storage | 150°C / 1000 hours | 15/0 | 3 | JESD22-A103-A* |
| Moisture Sensitivity | Surface Mount Only | 12 | 1 | J-STD-020-A* |