SLVSAG3A September   2010  – December 2014 TPS61252

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Typical Application Schematic
  5. Revision History
  6. Device Options
  7. Pin Configuration and Functions
  8. Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  9. Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1  Operation
      2. 10.3.2  Current Limit Operation
      3. 10.3.3  Softstart
      4. 10.3.4  Enable
      5. 10.3.5  Under-Voltage Lockout (UVLO)
      6. 10.3.6  Power Good
      7. 10.3.7  Input Over Voltage Protection
      8. 10.3.8  Load Disconnect and Reverse Current Protection
      9. 10.3.9  Thermal Regulation
      10. 10.3.10 Thermal Shutdown
    4. 10.4 Device Functional Modes
      1. 10.4.1 Power Save Mode
      2. 10.4.2 100% Duty-Cycle Mode
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Output Voltage Setting
        2. 11.2.2.2 Input Current Limit
        3. 11.2.2.3 Maximum Output Current
        4. 11.2.2.4 Inductor Selection
        5. 11.2.2.5 Output Capacitor
        6. 11.2.2.6 Input Capacitor
        7. 11.2.2.7 Checking Loop Stability
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
    3. 13.3 Thermal Considerations
  14. 14Device and Documentation Support
    1. 14.1 Device Support
      1. 14.1.1 Third-Party Products Disclaimer
    2. 14.2 Trademarks
    3. 14.3 Electrostatic Discharge Caution
    4. 14.4 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

8 Specifications

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Voltage(2) VIN, VOUT, SW, EN, PG, FB, ILIM –0.3 7 V
Temperature Operating junction, TJ –40 150 °C
Storage, Tstg –65 150
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
(2) All voltages are with respect to network ground terminal.

8.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions.

8.3 Recommended Operating Conditions

MIN NOM MAX UNIT
Supply voltage at VIN 2.3 6.0 V
Output voltage at VOUT 3.0 6.5 V
Programmable valley switch current limit set by RILIM 100 1500 mA
Operating free air temperature range, TA –40 85 °C
Operating junction temperature range, TJ –40 125 °C

8.4 Thermal Information

THERMAL METRIC(1) TPS61252 UNIT
DSG
8 PINS
RθJA Junction-to-ambient thermal resistance 80.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 93.5
RθJB Junction-to-board thermal resistance 54.2
ψJT Junction-to-top characterization parameter 0.9
ψJB Junction-to-board characterization parameter 59.3
RθJC(bot) Junction-to-case (bottom) thermal resistance 20
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

8.5 Electrical Characteristics

Over recommended free air temperature range, typical values are at TA = 25°C. Unless otherwise noted, specifications apply for condition VIN = EN = 3.6 V, VOUT = 5.0 V.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DC-DC STAGE
VIN Input voltage 2.3 6 V
VFB Feedback voltage 1.182 1.2 1.218 V
Lline regulation 0.5%
Load regulation 0.5%
f Oscillator frequency 3250 kHz
rDS(on) High side switch on resistance 200
Low side switch on resistance 130
Reverse leakage current into VOUT EN = GND 3.5 µA
ILIM Programmable valley switch current limit ILIM pin set to VIN 1500 mA
RILIM = 20 kΩ (500mA) -20% +20%
IQ Quiescent current IOUT = 0 mA, device not switching 30 µA
ISD Shutdown current 0.85 3.5 μA
OVP Input over voltage protection threshold Falling 6.4 V
Rising 6.5 V
CONTROL STAGE
VUVLO Under voltage lockout threshold Falling 2.0 2.1 V
Hysteresis 0.1 V
VIL EN input low voltage 2.3 V ≤ VIN ≤ 6.0 V 0.4 V
VIH EN input high voltage 2.3 V ≤ VIN ≤ 6.0 V 1.0 V
EN, PG input leakage current Clamped to GND or VIN 0.5 µA
Power Good threshold voltage Rising (% VOUT) 92.5% 95% 97.5%
Falling (% VOUT) 87.5% 90% 92.5%
Power good delay 10 µs
Overtemperature protection Rising 140 °C
Overtemperature hysteresis 20 °C

8.6 Typical Characteristics

Table 1. Table of Graphs

DESCRIPTION FIGURE
Efficiency vs Output current (VOUT = 5.0 V, ILIM = 1.5 A) Figure 1
vs Output current in 100% Duty-Cycle Mode (VOUT = 5.0 V, ILIM = 1.5 A) Figure 2
vs Input voltage (VOUT = 5.0 V, ILoad = {10; 100; 1000 mA}) , ILIM = 1.5 A Figure 3
Maximum output current vs Input voltage (VOUT = 5.0 V) Figure 4
Output voltage vs Output current (VOUT = 5.0V, ILIM = 1.5 A) Figure 5
eff2_io_lvsag3.gifFigure 1. Efficiency vs Output Current
eff_vi_lvsag3.gifFigure 3. Efficiency vs Input Voltage
vo_vi_stsb_lvsag3.gifFigure 5. Output Voltage vs Output Current
eff1_io_lvsag3.gifFigure 2. Efficiency vs Output Current
In 100% Duty Cycle Mode
max_Io_vi_lvsag3.gifFigure 4. Maximum Output Current vs Input Voltage