SLVAFH3 December   2022 TPS6213013A-Q1 , TPS62130A-Q1 , TPS62133A-Q1 , TPS62150A-Q1 , TPS62152A-Q1 , TPS62153A-Q1 , TPS62901-Q1 , TPS62902-Q1 , TPS62903-Q1 , TPS62992-Q1 , TPS62993-Q1

 

  1.   Abstract
  2.   Trademarks
  3. 1Introduction
  4. 2Achieving a Smaller Solution
    1. 2.1 Smaller Package and Fewer External Components
    2. 2.2 Smart Configuration Pin
    3. 2.3 VSET
  5. 3Reducing Power Loss
    1. 3.1 Junction Temperature
    2. 3.2 Automatic Efficiency Enhancement (AEE)
    3. 3.3 Quiescent Current
    4. 3.4 Auto PFM/PWM vs. Forced PWM
  6. 4Application Flexibility
    1. 4.1 1.0 MHz and 2.5 MHz Switching Frequencies
    2. 4.2 Lower and More Accurate Output Voltages
    3. 4.3 Output Voltage Discharge
    4. 4.4 Wettable Flanks
  7. 5Summary
  8. 6References

Introduction

The technology that drives buck converters is continuously being innovated to provide the best possible system performance. Power is at the heart of every electrical system, so improvements in size, efficiency, and thermal characteristics are beneficial to all applications. The TPS6290x-Q1 family is the next generation of 18V, low Iq, high efficiency, buck converters that improved upon the previous family TPS621x0A-Q1. The new generation also includes the TPS6299x-Q1 set of devices that feature a lower maximum input voltage of 10V. Table 1-1 shows the key features of each product and the improvements on the latest generation family. But what does improved really mean? To understand how technology has improved, this application report provides a comparison of the previous version to the new version, as well as an explanation of how the changes benefit the user more than the previous version.

Table 1-1 Feature comparison of TPS621x0A-Q1 and TPS629xx-Q1
Features TPS621x0A-Q1 TPS6290x-Q1 TPS6299x-Q1 Improvements
VIN 3 V to 17 V 3 V to 18 V 3 V to 10 V
VOUT 0.9 V to 6 V 0.4 V to 5.5 V Supports lower Vout down to 0.4 V(1)
FB accuracy (over temperature range) 1.8% 1.25% 31% tighter Vref accuracy
Typical quiescent current (device not switching) 17uA 4uA Better light load efficiency
Package size 3.0mmx3.0mm QFN 2.2mmx2.0mm QFN 51% smaller package
Smart configuration No Yes Fewer external components needed to configure device
Junction Temperature -40C to 125C -40C to 165C Supports higher Tj up to 165C
Switching Performance 2.5 MHz and 1.25 MHz 2.5 MHz and 1.0 MHz Wider range in frequency selection
RDS(ON) 90mΩ/40mΩ 62mΩ/22mΩ Less power loss
Efficiency (12Vin, 1.2Vo, 2.2uH, 3 A)(2) 78.9% (1.25 MHz) 83.0% (1MHz) N/A Improved efficiency
Efficiency (6Vin, 1.2Vo, 2.2uH, 3A)(2) 80.4% (1.25 MHz) 84.6% (1 MHz)
Automatic Efficiency Enhancement No Yes High efficiency for varying duty cycles
Output discharge Using PG Using VOS Achieved internally when selected
Selectable VOUT (VSET and internal voltage divider) No Yes This allows for internal divider that has lower BOM count and better overall system accuracy
Wettable flanks No Yes Enables visual inspection of solder joints (AVI)
VREF lowered from 0.8 V to 0.6 V with the 0.4 V output achieved through VSET only.
Efficiency measurements taken on the device's EVM using an XGL4020-222MEC inductor.