SFFS821 March   2024 SN74AXC4T774-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 TSSOP Package
    2. 2.2 VQFN Package
    3. 2.3 UQFN Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)

1 Overview

This document contains information for SN74AXC4T774-Q1 (TSSOP, VQFN, and UQFN packages) to aid in a functional safety system design. Information provided are:

  • Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and their distribution (FMD) based on the primary function of the device

Figure 1-1 shows the device functional block diagram for reference.

GUID-BD2EB739-07C2-4501-8036-3A8F663A4ED2-low.gifFigure 1-1 Functional Block Diagram

SN74AXC4T774-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.