SFFS795 February 2024 TXU0102-Q1
4 Pin Failure Mode Analysis (Pin FMA)
This section provides a Failure Mode Analysis (FMA) for the pins of the TXU0102-Q1 (VSSOP and SON package). The failure modes covered in this document include the typical pin-by-pin failure scenarios:
- Pin short-circuited to Ground (see Table 4-2)
- Pin open-circuited (see Table 4-3)
- Pin short-circuited to an adjacent pin (see Table 4-4)
- Pin short-circuited to supply (see Table 4-5 and Table 4-6)
Table 4-2 through Table 4-6 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.
Table 4-1 TI Classification of Failure Effects
| Class | Failure Effects |
|---|---|
| A | Potential device damage that affects functionality |
| B | No device damage, but loss of functionality |
| C | No device damage, but performance degradation |
| D | No device damage, no impact to functionality or performance |
Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:
Figure 4-1 shows the TXU0102-Q1 pin diagram for the VSSOP package. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the TXU0102-Q1 data sheet.
Figure 4-1 Pin Diagram (VSSOP) PackageFigure 4-2 shows the TXU0102-Q1 pin diagram for the SON package. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the TXU0102-Q1 data sheet.
Figure 4-2 Pin Diagram (SON Package)Table 4-2 Pin
FMA for Device Pins Short-Circuited to
Ground
| Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
|---|---|---|---|
| B2Y | 1 | Bx will be LOW, if corresponding Ax is HIGH, there will be potential damage to the device if the current is not limited. If corresponding Ax is LOW, then nothing will occur, no damage. | B |
| GND | 2 | Normal operation. | D |
| VCCA | 3 | Device will not be powered or damaged, because short is external to device. System level damage may occur in this scenario. | B |
| A2 | 4 | Ax will be LOW, if corresponding Bx is HIGH, there will be potential damage to the device if the current is not limited. If corresponding Bx is LOW, then nothing will occur, no damage. | B |
| A1 | 5 | B | |
| OE | 6 | All I/Os will be fixed into high impedance (3-state). | B |
| VCCB | 7 | Device will not be powered or damaged, because short is external to device. System level damage may occur in this scenario. | B |
| B1Y | 8 | Bx will be LOW, if corresponding Ax is HIGH, there will be potential damage to the device if the current is not limited. If corresponding Ax is LOW, then nothing will occur, no damage. | B |
Table 4-3 Pin
FMA for Device Pins Open-Circuited
| Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
|---|---|---|---|
| B2Y | 1 | Normal operation. | D |
| GND | 2 | Device will not be powered. | B |
| VCCA | 3 | Device will not be powered. | B |
| A2 | 4 | Ax pin will be grounded internally. | B |
| A1 | 5 | B | |
| OE | 6 | I/Os may be High Impedance or active, unknown input state. | A |
| VCCB | 7 | Device will not be powered. | B |
| B1Y | 8 | Normal operation. | D |
Table 4-4 Pin
FMA for Device Pins Short-Circuited to Adjacent
Pin
| Pin Name | Pin No. | Shorted to | Description of Potential Failure Effect(s) | Failure Effect Class |
|---|---|---|---|---|
| B2Y | 1 | GND | Bx will be LOW, if corresponding Ax is HIGH, there will be potential damage to the device if the current is not limited. If corresponding Ax is LOW, then nothing will occur, no damage. | B |
| GND | 2 | VCCA | Device will not be powered or damaged, because short is external to device. System level damage may occur in this scenario. | B |
| VCCA | 3 | A2 | Ax will be HIGH, if corresponding Bx is LOW, there will be potential damage to the device if the current is not limited. If corresponding Bx is HIGH, then nothing will occur, no damage. | B |
| A2 | 4 | A1 | Two inputs shorted together will not cause damage unless there is external bus contention that drives the input such that VIL < Input Voltage < VIH in which case excessive supply current to GND may cause damage. | B |
| A1 | 5 | OE | If A1 is HIGH, device will be enabled. If A1 is LOW, device will be disabled | B |
| OE | 6 | VCCB | All I/Os will be active, device cannot be disabled. | B |
| VCCB | 7 | B1Y | Bx will be HIGH, if corresponding Ax is LOW, there will be potential damage to the device if the current is not limited. If corresponding Ax is HIGH, then nothing will occur, no damage. | B |
| B1Y | 8 | B2Y | Two outputs shorted together may cause damage if there is external bus contention that drives one output LOW while driving the other output HIGH. | A |
Table 4-5 Pin
FMA for Device Pins Short-Circuited to supply
VCCA
| Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
|---|---|---|---|
| B2Y | 1 | Bx will be HIGH, if corresponding Ax is LOW, there will be potential damage to the device if the current is not limited. If corresponding Ax is HIGH, then nothing will occur, no damage. | B |
| GND | 2 | Device will not be powered or damaged, because short is external to device. System level damage may occur in this scenario. | B |
| VCCA | 3 | Normal operation. | D |
| A2 | 4 | Ax will be HIGH, if corresponding Bx is LOW, there will be potential damage to the device if the current is not limited. If corresponding Bx is HIGH, then nothing will occur, no damage. | B |
| A1 | 5 | B | |
| OE | 6 | All I/Os will be active, device cannot be disabled. | B |
| VCCB | 7 | Device will not be powered or damaged, because short is external to device. System level damage may occur in this scenario. | B |
| B1Y | 8 | Bx will be HIGH, if corresponding Ax is LOW, there will be potential damage to the device if the current is not limited. If corresponding Ax is HIGH, then nothing will occur, no damage. | B |
Table 4-6 Pin
FMA for Device Pins Short-Circuited to supply
VCCB
| Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
|---|---|---|---|
| B2Y | 1 | Bx will be HIGH, if corresponding Ax is LOW, there will be potential damage to the device if the current is not limited. If corresponding Ax is HIGH, then nothing will occur, no damage. | B |
| GND | 2 | Device will not be powered or damaged, because short is external to device. System level damage may occur in this scenario. | B |
| VCCA | 3 | Device will not be powered or damaged, because short is external to device. System level damage may occur in this scenario. | B |
| A2 | 4 | Ax will be HIGH, if corresponding Bx is LOW, there will be potential damage to the device if the current is not limited. If corresponding Bx is HIGH, then nothing will occur, no damage. | B |
| A1 | 5 | B | |
| OE | 6 | All I/Os will be active, device cannot be disabled. | B |
| VCCB | 7 | Normal operation. | D |
| B1Y | 8 | Bx will be HIGH, if corresponding Ax is LOW, there will be potential damage to the device if the current is not limited. If corresponding Ax is HIGH, then nothing will occur, no damage. | B |