SFFS667 November   2023 LMR36500

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 LMR36500
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)

Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the LMR36500. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

  • Pin short-circuited to Ground (see Table 4-2)
  • Pin open-circuited (see Table 4-3)
  • Pin short-circuited to an adjacent pin (see Table 4-4)
  • Pin short-circuited to supply (see Table 4-5)

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality
BNo device damage, but loss of functionality
CNo device damage, but performance degradation
DNo device damage, no impact to functionality or performance

Figure 4-1 shows the LMR36500 pin diagram. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the LMR36500 data sheet.

GUID-20230921-SS0I-5PKR-T4TH-VW3QFNXDKZHN-low.svg Figure 4-1 Pin Diagram
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
RT1Switching Frequency is 2.2 MHzD
PGOOD2When not in use can be left grounded (PGOOD is not a valid signal, VOUT normal)D
EN/UVLO3VOUT = 0 V (Enable is off, functionality is halted)D
VIN4VOUT = 0 VB
SW5Damage HSFETA
BOOT6VOUT = 0 V, HS will not turn on B
VCC7VOUT = 0 VB
VOUT/FB8VOUT = 0 VB
GND9VOUT normal D
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
RT 1 Frequency will not be defined. C
PGOOD 2 When not in use, can be left open (PGOOD is not a valid signal, VOUT normal) D
EN/UVLO 3 Pin cannot be left floating B
VIN 4 VOUT = 0 V B
SW 5 VOUT = 0 V B
BOOT 6 VOUT = 0, HS will not turn on B
VCC 7 VCC output will be unstable, can increase above 5.5 V A
VOUT/FB 8 VOUT will be abnormal. Do not float this pin. C
GND 9 VOUT can be abnormal, as reference voltage is not fixed B
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin NamePin No.Shorted toDescription of Potential Failure Effect(s)Failure Effect Class
RT1PGOODIf PGOOD is high, and less than 5.5 V Fsw = 1 MHz; If PGOOD is low, Fsw = 2.2 MHz. RT pin will become damaged if PG exceeds 5.5 V.A
PGOOD2EN/UVLOIf EN/UVLO > 20 V, it will damage devices connected to PGOOD pin.A
EN/UVLO3VINVOUT normal (Enable is on, all other blocks will work)D
VIN4SWDamage LSFETA
SW5BOOTVOUT = 0 V, HS will not turn on, no CbootB
BOOT6VCCDamage will occur, break VCC PinA
VCC7VOUT/FBIf VOUT/FB votlage is less than 5.5 V, then no damage will occur.B
VOUT/BIAS or FB8GNDVOUT = 0 VB
GND9RT or MODEIf RT pin is already low, then the part is functional. Otherwise abnormal behavior. No damage to part.B
Table 4-5 Pin FMA for Device Pins Short-Circuited to supply
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
RT1If Vin > 5.5 V, damage will occur. If Vin < 5.5 V, refer to the data sheet.A
PGOOD2If VIN > 20 V, damage will occur.A
EN/UVLO3VOUT normal (Enable is on, all other blocks will work).D
VIN4VOUT normal.D
SW5Damage LSFET.A
BOOT6Damage will occur, BOOT ESD clamp will be damaged.A
VCC7If Vin > 5.5, damage will occur. A
VOUT/FB8If VIN > 16 V, damage will occur.A
GND9VOUT = 0 VB