SFFS344 December   2021 LM5001-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)

Pin Failure Mode Analysis (Pin FMA)

This section provides a failure mode analysis (FMA) for the pins of the LM5001-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

  • Pin short-circuited to ground (see Table 4-2)
  • Pin open-circuited (see Table 4-3)
  • Pin short-circuited to an adjacent pin (see Table 4-4)
  • Pin short-circuited to supply (see Table 4-5)

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality.
BNo device damage, but loss of functionality.
CNo device damage, but performance degradation.
DNo device damage, no impact to functionality or performance.

Figure 4-1 shows the LM5001-Q1 pin diagram. For a detailed description of the device pins, see the Pin Configuration and Functions section in the LM5001-Q1 data sheet.

GUID-019BDF3D-06B8-45B4-9316-2514EA055601-low.gif Figure 4-1 Pin Diagram

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • Device used withing the Recommended Operating Conditions and Absolute Maximum Ratings found in the LM5001-Q1 data sheet
  • For the analysis, the boost typical application as shown in the LM5001-Q1 data sheet in the Typical Application section is used
  • VIN = 12 V
  • VOUT = 48 V
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
SW 1 No switching. Input voltage is shorted to ground B
VIN 2 No switching. No input voltage B
VCC 3 No switching. No VCC voltage B
GND 4 Normal configuration D
RT 5 Oscillator runs at maximum frequency. Possible unstable output voltage C
FB 6 Open loop operation, which can result in excessive output voltage, and in turn, can cause damage to both the IC and external circuit. A
COMP 7 No switching B
EN 8 No switching. Device is disabled. B
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
SW 1 No switching. Output voltage not regulated B
VIN 2 No switching. No input voltage B
VCC 3 No stable VCC to sustain normal operation B
GND 4 Possible device damage A
RT 5 Minimum oscillator frequency is set. C
FB 6 Open loop operation, which can result in excessive output voltage, and in turn, can cause damage to both the IC and external circuit. A
COMP 7 Lack of proper loop compensation for stable operation B
EN 8 Pin can be left floating and start-up D
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin NamePin No.Shorted toDescription of Potential Failure Effect(s)Failure Effect Class
SW1VINInternal switch shorted to VIN, device damage is likelyA
VIN2VCCDamage to VCC if VIN voltage is greater then 14 VA
VCC3GNDNo switching. No VCC voltageB
RT 5 FB Switching frequency not stable C
FB 6 COMP Lack of proper loop compensation for stable operation. B
COMP 7 EN Damage to COMP if EN voltage is greater than 7 V A
Table 4-5 Pin FMA for Device Pins Short-Circuited to supply
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
SW 1 Internal switch shorted to supply, device damage is likely A
VIN 2 Normal operation D
VCC 3 Internal LDO is by passed. Internal rails supplied with VIN. D
GND 4 Possible damage to the device A
RT 5 Exceeds RT absolute maximum voltage rating of 7 V A
FB 6 Exceeds FB absolute maximum voltage rating of 7 V A
COMP 7 Exceeds COMP absolute maximum voltage rating of 7 V A
EN 8 Normal operation D