SCDA025 September   2022 TS3A27518E-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 TSSOP-24 Package
    2. 2.2 QFN-24 Package
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 TSSOP-24 Package
    2. 4.2 QFN-24 Package

Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the TS3A27518E-Q1 (TSSOP-24 and QFN-24 package). The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Table 4-2 through Table 4-9 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
Class Failure Effects
A Potential device damage that affects functionality
B No device damage, but loss of functionality
C No device damage, but performance degradation
D No device damage, no impact to functionality or performance

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • External pull-up resistor on CS to VDD
  • RC filter on every analog input, AINx.
    Series resistors are sized to limit the input currents into the analog inputs to <10 mA in all circumstances, for example also in case device is unpowered and input signal is applied.
  • Device is the only target on the SPI bus.