ZHCSHO6 February   2018 XTR305

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Voltage Output Mode
    6. 6.6  Electrical Characteristics: Current Output Mode
    7. 6.7  Electrical Characteristics: Operational Amplifier (OPA)
    8. 6.8  Electrical Characteristics: Instrumentation Amplifier (IA)
    9. 6.9  Electrical Characteristics: Current Monitor
    10. 6.10 Electrical Characteristics: Power and Digital
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Functional Features
      2. 7.3.2 Current Monitor
      3. 7.3.3 Error Flags
      4. 7.3.4 Power On/Off Glitch
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Voltage Output Mode
        2. 8.2.2.2  Current Output Mode
        3. 8.2.2.3  Input Signal Connection
        4. 8.2.2.4  Externally-Configured Mode: OPA and IA
        5. 8.2.2.5  Driver Output Disable
        6. 8.2.2.6  Driving Capacitive Loads and Loop Compensation
        7. 8.2.2.7  Internal Current Sources, Switching Noise, and Settling Time
        8. 8.2.2.8  IA Structure, Voltage Monitor
        9. 8.2.2.9  Digital I/O and Ground Considerations
        10. 8.2.2.10 Output Protection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 VQFN Package and Heat Sinking
    4. 10.4 Power Dissipation
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.5 Electrical Characteristics: Voltage Output Mode

All specifications at TA = 25°C, VS = ±20 V, RLOAD = 800 Ω, RSET = 2 kΩ, ROS = 2 kΩ, VREF = 4 V, RGAIN = 10 kΩ, input signal span 0 V to 4 V, and CC = 100 pF, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
OFFSET VOLTAGE
VOS Offset voltage, RTI ±0.4 ±2.5 mV
dVOS/dT Offset voltage vs temperature TA = –40°C to 85°C ±1.6 ±10 μV/°C
PSRR Offset voltage vs power supply VS = ±5 V to ±22 V ±0.2 ±10 μV/V
INPUT VOLTAGE RANGE
Nominal setup for ±10-V output See Figure 35
Input voltage for linear operation (V−) + 3 (V+) − 3 V
NOISE
Voltage noise, f = 0.1 Hz to 10 Hz, RTI 3 μVPP
en Voltage noise density, f = 1 kHz, RTI 40 nV/√Hz
OUTPUT
Voltage output swing from rail IDRV ≤ 15 mA, TA = –40°C to 85°C (V−) +3 (V+) − 3 V
Gain nonlinearity ±0.01 ±0.2 %FS
Gain nonlinearity vs temperature TA = –40°C to 85°C ±0.1 ±1 ppm/°C
IB Gain error ±0.04 ±0.2 %FS
Gain error vs temperature TA = –40°C to 85°C ±0.2 ±1 ppm/°C
Output impedance, dVDRV/dIDRV 7 mΩ
Output leakage current while output disabled OD pin = L(1), TA = –40°C to 85°C 30 nA
ISC Short-circuit current TA = –40°C to 85°C ±15 ±20 ±24 mA
CLOAD Capacitive load drive CC = 10 nF, RC = 15(2) 1 μF
Rejection of voltage difference between GND1 and GND2, RTO 130 dB
FREQUENCY RESPONSE
Bandwidth(4) −3 dB, G = 5 300 kHz
SR Slew rate(2) 1 V/μs
CC = 10 nF, CLOAD = 1 μF, RC = 15 Ω 0.015
Settling time(2)(3), 0.1%, small signal VDRV = ±1 V 8 μs
Overload recovery time 50% overdrive 12 μs
(1) Output leakage includes input bias current of INA.
(4) Small signal with no capacitive load.