ZHCSQX4F August   1995  – August 2022 UC1823A , UC1825A , UC2823A , UC2823B , UC2825A , UC2825B , UC3823A , UC3823B , UC3825A , UC3825B

PRODUCTION DATA  

  1. 1特性
  2. 2说明
  3. 3Revision History
  4. 4Ordering Information
  5. 5Pin Configuration and Functions
    1.     Terminal Functions
  6. 6Specifications
    1. 6.1 ABSOLUTE MAXIMUM RATINGS
    2. 6.2 Thermal Information
    3. 6.3 ELECTRICAL CHARACTERISTICS
    4. 6.4 ELECTRICAL CHARACTERISTICS
  7. 7Application and Implementation
    1. 7.1 LEADING EDGE BLANKING
    2. 7.2 UVLO、软启动和故障管理
    3. 7.3 ACTIVE LOW OUTPUTS DURING UVLO
    4. 7.4 CONTROL METHODS
    5. 7.5 SYNCHRONIZATION
    6. 7.6 HIGH CURRENT OUTPUTS
    7. 7.7 GROUND PLANES
    8. 7.8 OPEN LOOP TEST CIRCUIT
  8. 8Device and Documentation Support
    1. 8.1 Documentation Support
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 术语表
  9. 9Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DW|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.5 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.