ZHCSHG2E January   2018  – April 2019 TS5MP646

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      D-PHY 简化原理图
      2.      C-PHY 简化原理图
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Powered-Off Protection
      2. 8.3.2 1.8-V Logic Compatible Inputs
      3. 8.3.3 Low Power Disable Mode
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pin Functions
      2. 8.4.2 Low Power Disable Mode
      3. 8.4.3 Switch Enabled Mode
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
        1. 9.2.3.1 MIPI D-PHY Application
        2. 9.2.3.2 MIPI C-PHY Application
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Layout Guidelines

Place the supply de-coupling capacitors as close to the VDD and GND pin as possible. The spacing between the power traces, supply and ground, and the signal I/O lines, clock and data, should be a minimum of three times the race width of the signal I/O lines to maintain signal integrity.

The characteristic impedance of the trace(s) must match that of the receiver and transmitter to maintain signal integrity. Route the high-speed traces using a minimum amount of vias and corners. This will reduce the amount of impedance changes.

When it becomes necessary to make the traces turn 90°, use two 45° turns or an arc instead of making a single 90° turn.

Do not route high-speed traces near crystals, oscillators, external clock signals, switching regulators, mounting holes or magnetic devices.

Avoid stubs on the signal lines.

All I/O signal traces should be routed over a continuous ground plane with no interruptions. The minimum width from the edge of the trace to any break in the ground plane must be 3 times the trace width. When routing on PCB inner signal layers, the high speed traces should be between two ground planes and maintain characteristic impedance.

High speed signal traces must be length matched as much as possible to minimize skew between data and clock lines.