ZHCSJI3H 数据表 | 德州仪器 TI.com.cn

ZHCSJI3H March 2007 – August 2022 TS3A24159

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		TS3A24159			UNIT
		DGS (VSSOP)	DRC (VSON)	YZP (DSBGA)
		10 PINS	10 PINS	10 PINS
R_θJA	Junction-to-ambient thermal resistance	154	49.4	90.9	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	37.9	71.2	0.3	°C/W
R_θJB	Junction-to-board thermal resistance	83.6	23.8	8.3	°C/W
ψ_JT	Junction-to-top characterization parameter	1.4	2.2	3.2	°C/W
ψ_JB	Junction-to-board characterization parameter	82.2	23.8	8.3	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	6.1	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.