ZHCSHN7B February   2018  – April 2018 TPSM84624

PRODUCTION DATA.  

  1. 特性
  2. 应用
    1.     简化原理图
  3. 说明
    1.     瞬态响应
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics (VIN = 12 V)
    8. 6.8 Typical Characteristics (VIN = 5 V)
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Adjusting the Output Voltage
      2. 7.3.2  Switching Frequency (RT)
      3. 7.3.3  Synchronization (CLK)
      4. 7.3.4  Output On/Off Enable (EN)
      5. 7.3.5  Input Capacitor Selection
      6. 7.3.6  Output Capacitor Selection
      7. 7.3.7  TurboTrans (TT)
        1. 7.3.7.1 Low-ESR Output Capacitors
        2. 7.3.7.2 Transient Response
          1. 7.3.7.2.1 Transient Waveforms (VIN = 12 V)
      8. 7.3.8  Undervoltage Lockout (UVLO)
      9. 7.3.9  Soft Start (SS/TR)
      10. 7.3.10 Sequencing (SS/TR)
      11. 7.3.11 Power Good (PGOOD)
      12. 7.3.12 Safe Start-Up Into Pre-Biased Outputs
      13. 7.3.13 Overcurrent Protection
      14. 7.3.14 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Shutdown Mode
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Setpoint
        3. 8.2.2.3 Setting the Switching Frequency
        4. 8.2.2.4 Input Capacitors
        5. 8.2.2.5 Output Capacitors
        6. 8.2.2.6 TurboTrans Resistor
        7. 8.2.2.7 Application Waveforms
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 EMI
      1. 10.3.1 EMI Plots
    4. 10.4 Package Specifications
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 使用 WEBENCH® 工具创建定制设计
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Layout Guidelines

To achieve optimal electrical and thermal performance, an optimized PCB layout is required. Figure 27 thru Figure 30, shows a typical PCB layout. Some considerations for an optimized layout are:

  • Use large copper areas for power planes (VIN, VOUT, and PGND) to minimize conduction loss and thermal stress.
  • Place ceramic input and output capacitors close to the device pins to minimize high frequency noise.
  • Locate additional output capacitors between the ceramic capacitor and the load.
  • Keep AGND and PGND separate from one another. The connection is made internal to the device.
  • Place RFBB, RRT, and CSS as close as possible to their respective pins.
  • Use multiple vias to connect the power planes (VIN, VOUT, and PGND) to internal layers.