ZHCSPT6C July   2023  – April 2024 TPSM8287A06 , TPSM8287A12 , TPSM8287A15

PRODMIX  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed-Frequency DCS-Control Topology
      2. 7.3.2  Forced-PWM and Power-Save Modes
      3. 7.3.3  Precise Enable
      4. 7.3.4  Start-Up
      5. 7.3.5  Switching Frequency Selection
      6. 7.3.6  Output Voltage Setting
        1. 7.3.6.1 Output Voltage Setpoint
        2. 7.3.6.2 Output Voltage Range
        3. 7.3.6.3 Non-Default Output Voltage Setpoint
        4. 7.3.6.4 Dynamic Voltage Scaling (DVS)
      7. 7.3.7  Compensation (COMP)
      8. 7.3.8  Mode Selection / Clock Synchronization (MODE/SYNC)
      9. 7.3.9  Spread Spectrum Clocking (SSC)
      10. 7.3.10 Output Discharge
      11. 7.3.11 Undervoltage Lockout (UVLO)
      12. 7.3.12 Overvoltage Lockout (OVLO)
      13. 7.3.13 Overcurrent Protection
        1. 7.3.13.1 Cycle-by-Cycle Current Limiting
        2. 7.3.13.2 Hiccup Mode
        3. 7.3.13.3 Current-Limit Mode
      14. 7.3.14 Power Good (PG)
        1. 7.3.14.1 Power-Good Standalone, Primary Device Behavior
        2. 7.3.14.2 Power-Good Secondary Device Behavior
      15. 7.3.15 Remote Sense
      16. 7.3.16 Thermal Warning and Shutdown
      17. 7.3.17 Stacked Operation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-On Reset (POR)
      2. 7.4.2 Undervoltage Lockout
      3. 7.4.3 Standby
      4. 7.4.4 On
    5. 7.5 Programming
      1. 7.5.1 Serial Interface Description
      2. 7.5.2 Standard-, Fast-, Fast-Mode Plus Protocol
      3. 7.5.3 I2C Update Sequence
      4. 7.5.4 I2C Register Reset
  9. 8 Device Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Selecting the Input Capacitors
        2. 9.2.2.2 Selecting the Target Loop Bandwidth
        3. 9.2.2.3 Selecting the Compensation Resistor
        4. 9.2.2.4 Selecting the Output Capacitors
        5. 9.2.2.5 Selecting the Compensation Capacitor, CComp1
        6. 9.2.2.6 Selecting the Compensation Capacitor, CComp2
      3. 9.2.3 Application Curves
    3. 9.3 Typical Application Using Four TPSM8287Axx in Parallel Operation
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
        1. 9.3.2.1 Selecting the Input Capacitors
        2. 9.3.2.2 Selecting the Target Loop Bandwidth
        3. 9.3.2.3 Selecting the Compensation Resistor
        4. 9.3.2.4 Selecting the Output Capacitors
        5. 9.3.2.5 Selecting the Compensation Capacitor, CComp1
        6. 9.3.2.6 Selecting the Compensation Capacitor, CComp2
      3. 9.3.3 Application Curves
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 第三方产品免责声明
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 接收文档更新通知
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
  • RDW|39
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.4 支持资源

TI E2E™ 中文支持论坛是工程师的重要参考资料，可直接从专家处获得快速、经过验证的解答和设计帮助。搜索现有解答或提出自己的问题，获得所需的快速设计帮助。

链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅 TI 的使用条款。