ZHCSD16A October   2014  – November 2014 TPS8268090 , TPS8268105 , TPS8268150

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Parameter Measurement Information
    1. 8.1 Schematic
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Soft Start
      2. 9.3.2 Undervoltage Lockout
      3. 9.3.3 Short-Circuit Protection
      4. 9.3.4 Thermal Shutdown
      5. 9.3.5 Enable
      6. 9.3.6 MODE Pin
    4. 9.4 Device Functional Modes
      1. 9.4.1 Spread Spectrum, PWM Frequency Dithering
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Input Capacitor Selection
        2. 10.2.2.2 Output Capacitor Selection
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Surface Mount Information
    4. 12.4 Thermal and Reliability Information
  13. 13器件和文档支持
    1. 13.1 文档支持
      1. 13.1.1 参考书目
    2. 13.2 相关链接
    3. 13.3 商标
    4. 13.4 静电放电警告
    5. 13.5 术语表
  14. 14机械封装和可订购信息
    1. 14.1 封装概要
    2. 14.2 MicroSiP™ DC/DC 模块封装尺寸

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
VI Voltage at VIN(2) –0.3 6 V
Voltage at VOUT(2) –0.3 3.6
Voltage at EN, MODE(2) –0.3 VIN + 0.3
Peak output current 1600 mA
TJ Operating internal junction temperature range –40 125 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.

7.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –55 125 °C
ESD rating (1)(2)(3) Human body model –2 2 kV
Charge device model –500 500 V
Machine model –100 100 V
(1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in to the device.
(2) Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN Input voltage range 2.5 5.5 V
IOUT Peak output current for TPS8268090, TPS8268105 VIN ≥ 2.8V 0 1600(1) mA
Peak output current for TPS8268150 VIN ≥ 3.2V
IOUT Average output current for TPS8268090, TPS8268105 VIN ≥ 2.7V 0 1200(1) mA
Average output current for TPS8268150 VIN ≥ 2.9V
IOUT Average output current during soft-start Vout ≤ 0.9 x VOUT,nom 0 1000(1) mA
Additional effective input capacitance 0 µF
Additional effective output capacitance 0 30(2) µF
TA Operating ambient temperature range –40 85 °C
(1) See Thermal and Reliability Information for additional details
(2) Due to the dc bias effect of ceramic capacitors, the effective capacitance is lower then the nominal value when a voltage is applied.

7.4 Thermal Information

THERMAL METRIC(1) TPS8268x UNIT
SIP
9 PINS
RθJA Junction-to-ambient thermal resistance 62 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 22
RθJB Junction-to-board thermal resistance 25
ψJT Junction-to-top characterization parameter 11
ψJB Junction-to-board characterization parameter 25
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

Minimum and maximum values are at VIN = 2.5V to 5.5V, EN = VIN and TA = –40°C to 85°C; Circuit of Parameter Measurement Information section (unless otherwise noted). Typical values are at VIN = 3.6V, EN = VIN and TA = 25°C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
IQ Operating quiescent current IOUT = 0mA 7 mA
ISD Shutdown current EN = low 0.5 5 μA
UVLO Undervoltage lockout threshold VIN rising 2.1 2.3 V
VIN falling 1.95 2.25 V
ENABLE, MODE
VIH High-level input voltage 0.9 V
VIL Low-level input voltage 0.4 V
Ilkg Input leakage current Input connected to GND or VIN; TJ = –40°C to 85°C 0.01 1.5 μA
PROTECTION
Thermal shutdown Temperature rising 140 °C
Thermal shutdown hysteresis Temperature falling 10 °C
ILIM Average output current limit 2100 mA
ISC Input current limit under short-circuit condition VOUT shorted to ground 150 mA
OUTPUT
TPS8268150 1.50 V
VOUT,NOM Nominal output voltage TPS8268105 1.05 V
TPS8268090 0.9 V
Output voltage accuracy TPS8268105, TPS8268090 2.8V ≤ VIN ≤ 5.5V, 0mA ≤ IOUT ≤ 1600 mA
TJ = –40°C to 85°C
0.985×VOUT,NOM VOUT,NOM 1.015×VOUT,NOM V
TPS8268150 3.2V ≤ VIN ≤ 5.5V, 0mA ≤ IOUT ≤ 1600 mA
TJ = –40°C to 85°C
TPS8268105, TPS8268090 2.7V ≤ VIN ≤ 5.5V, 0mA ≤ IOUT ≤ 1200 mA
TJ = –40°C to 125°C
0.98×VOUT,NOM VOUT,NOM 1.025×VOUT,NOM V
TPS8268150 2.9V ≤ VIN ≤ 5.5V, 0mA ≤ IOUT ≤ 1200 mA
TJ = –40°C to 125°C
Line regulation VIN = 2.5V to 5.5V, IOUT = 200 mA 0.2 %/V
Load regulation IOUT = 0mA to 1600 mA –0.85 %/A
fSW Nominal oscillator frequency IOUT = 0mA 5.5 MHz
Start-up delay time Time from EN = high to start switching 120 300 μs
tRAMP Ramp time IOUT = 0mA, Time from start switching until 95% of nominal output voltage 150 μs
RDIS VOUT discharge resistor 12 Ω

7.6 Typical Characteristics

C001_SLVSBR0.png
VOUT = 1.50V 25°C
Figure 1. Efficiency vs Output Current
C003_SLVSBR0.png
VOUT = 1.50 V 25°C
Figure 3. Output Voltage vs Input Voltage
C010_SLVSBR0.png
VOUT = 1.05V 25°C
Figure 5. Efficiency vs Output Current
C012_SLVSBR0.png
VOUT = 1.05 V 25°C
Figure 7. Output Voltage vs Input Voltage
C004_SLVSBR0.png
VOUT = 0.9 V 25°C
Figure 9. Efficiency vs Output Current
C016_SLVSBR0.png
VIN = 0.9 V 25°C
Figure 11. Output Voltage vs Input Voltage
C002_SLVSBR0.png
VOUT = 1.50 V 25°C
Figure 2. Output Voltage vs Output Current
C019_SLVSBR0.png
VOUT = 1.50 V 25°C
Figure 4. Switching Frequency vs Output Current
C011_SLVSBR0.png
VOUT = 1.05 V 25°C
Figure 6. Output Voltage vs Output Current
C018_SLVSBR0.png
VOUT = 1.05 V 25°C
Figure 8. Switching Frequency vs Output Current
C007_SLVSBR0.png
VIN = 0.9 V 25°C
Figure 10. Output Voltage vs Output Current
C017_SLVSBR0.png
VIN = 0.9 V 25°C
Figure 12. Switching Frequency vs Output Current