ZHCSDQ2C January   2015  – September 2018 TPS7B7701-Q1 , TPS7B7702-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     703A I2C
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fault Detection and Protection
      2. 7.3.2  Short-Circuit and Overcurrent Protection
      3. 7.3.3  Short-to-Battery and Reverse Current Detection
      4. 7.3.4  Thermal Shutdown
      5. 7.3.5  Integrated Reverse-Polarity Protection
      6. 7.3.6  Integrated Inductive Clamp
      7. 7.3.7  Undervoltage Lockout
      8. 7.3.8  Enable (EN, EN1, and EN2)
      9. 7.3.9  Internal Voltage Regulator (VCC)
      10. 7.3.10 Current Sense Multiplexing
      11. 7.3.11 Adjustable Output Voltage (FB, FB1, and FB2)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With IN < 4.5 V
      2. 7.4.2 Operation With EN Control
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Capacitor
        2. 8.2.2.2 Output Capacitor
        3. 8.2.2.3 Current Sense Resistor Selection
        4. 8.2.2.4 Current-Limit Resistor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 相关链接
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.3.4 Thermal Shutdown

The device incorporates a TSD circuit as a protection from overheating. For continuous normal operation, the junction temperature should not exceed the TSD trip point. If the junction temperature exceeds the TSD trip point, the output is turned off. When the junction temperature decreases by 15°C (typical) than the TSD trip point, the output is turned on again. The SENSE voltage is internally pulled up to a voltage rail between 2.7 V and 3 V during TSD status.

NOTE

The purpose of the design of the internal protection circuitry of the TPS7B770x-Q1 family of devices is to protect against overload conditions and is not intended as a replacement for proper heat-sinking. Continuously running the device into thermal shutdown degrades device reliability.