ZHCSI96J March   2010  – March 2020 TPS7A60-Q1 , TPS7A61-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      可编程复位延迟选项
      2.      使能选项
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Reset Delay and Reset Output
      2. 8.3.2 Charge Pump Operation
      3. 8.3.3 Undervoltage Shutdown
      4. 8.3.4 Low-Voltage Tracking
      5. 8.3.5 Integrated Fault Protection
      6. 8.3.6 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Low-Power Mode
      2. 8.4.2 Sleep Mode (TPS7A61-Q1 Only)
      3. 8.4.3 Regulation Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 TPS7A60-Q1 Typical Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Input Capacitor
          2. 9.2.1.2.2 Output Capacitor
        3. 9.2.1.3 Application Curve
      2. 9.2.2 TPS7A61-Q1 Typical Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Power Dissipation and Thermal Considerations
    2. 11.2 Layout Examples
  12. 12器件和文档支持
    1. 12.1 相关链接
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1)(2) TPS7A60-Q1, TPS7A61-Q1 TPS7A60-Q1 UNIT
KVU (TO-252) KTT (TO-263)
5 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 26.9 24.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 32.2 38.9 °C/W
RθJB Junction-to-board thermal resistance 6.5 7.4 °C/W
ψJT Junction-to-top characterization parameter 2.5 3.8 °C/W
ψJB Junction-to-board characterization parameter 6.5 7.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 2.8 1.5 °C/W
(1) The thermal data is based on JEDEC standard high K profile JESD 51-5. The copper pad is soldered to the thermal land pattern. The correct attachment procedure must be incorporated.
(2) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.