ZHCSU17F March   2009  – April 2024 TPS798-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Dissipation Ratings
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Adjustable Operation
      2. 6.3.2 Output Capacitance and Transient Response
      3. 6.3.3 Calculating Junction Temperature
      4. 6.3.4 Protection Features
    4. 6.4 Device Functional Modes
      1. 6.4.1 Low-Voltage Tracking
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Thermal Considerations
      2. 7.3.2 Thermal Layout Considerations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 Trademarks
    4. 8.4 静电放电警告
    5. 8.5 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

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7.3.1 Thermal Considerations

The power handling capability of the device is limited by the maximum rated junction temperature (125°C). The power dissipated by the device consists of two components:

  • Output current multiplied by the input/output voltage differential: IOUT × (VIN – VOUT)
  • GND pin current multiplied by the input voltage: IGND × VIN

The GND pin current can be found by examining the GND pin current curves in the Typical Characteristics. Power dissipation is equal to the sum of the two components listed previously.

The TPS798-Q1 series regulators have internal thermal limiting designed to protect the device during overload conditions. Do not exceed the maximum junction temperature rating of 125°C. All sources of thermal resistance from junction to ambient must be carefully considered. Additional heat sources mounted nearby must also be considered.

For surface-mount devices, heat sinking is accomplished by using the heat-spreading capabilities of the printed-circuit-board (PCB) and its copper traces. Copper board stiffeners and plated through-holes can also be used to spread the heat generated by power devices.