ZHCSN51J
june 2007 – april 2023
TPS74901
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics: Other Orderable Devices (non-M3 Suffix)
6.6
Electrical Characteristics: Orderable Device (M3 Suffix)
6.7
Typical Characteristics: IOUT = 50 mA (All Other Orderable Devices, Non-M3 Suffix)
6.8
Typical Characteristics: IOUT = 1 A (All Other Orderable Devices, Non-M3 Suffix)
6.9
Typical Characteristics: IOUT = 50 mA (M3 Suffix)
6.10
Typical Characteristics: IOUT = 1 A (M3 Suffix)
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Enable and Shutdown
7.3.2
Power-Good
7.3.3
Internal Current Limit
7.3.4
Thermal Protection
7.4
Device Functional Modes
7.4.1
Normal Operation
7.4.2
Dropout Operation
7.4.3
Disabled
8
Application and Implementation
8.1
Application Information
8.1.1
Input, Output, and BIAS Capacitor Requirements
8.1.2
Transient Response
8.1.3
Dropout Voltage
8.1.4
Output Noise
8.1.5
Programmable Soft-Start
8.1.6
Sequencing Requirements
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curves
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.1.1
Power Dissipation
8.4.1.2
Thermal Considerations
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Device Support
9.1.1
Development Support
9.1.1.1
Evaluation Modules
9.1.1.2
Spice Models
9.2
Documentation Support
9.2.1
Related Documentation
9.3
接收文档更新通知
9.4
支持资源
9.5
Trademarks
9.6
静电放电警告
9.7
术语表
10
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
KTW|7
MPSF015
RGW|20
MPQF122C
DRC|10
MPDS117L
散热焊盘机械数据 (封装 | 引脚)
RGW|20
QFND012L
DRC|10
QFND013N
订购信息
zhcsn51j_oa
zhcsn51j_pm
8.2.3
Application Curves
Figure 8-5
V
IN
PSRR vs (V
IN
– V
OUT
)
Figure 8-6
Noise Spectral Density