ZHCSDM4D december   2014  – may 2023 TPS65263-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Adjusting the Output Voltage
      2. 7.3.2  Enable and Adjusting UVLO
      3. 7.3.3  Soft-Start Time
      4. 7.3.4  Power-Up Sequencing
      5. 7.3.5  V7V Low-Dropout Regulator and Bootstrap
      6. 7.3.6  Out-of-Phase Operation
      7. 7.3.7  Output Overvoltage Protection (OVP)
      8. 7.3.8  PSM
      9. 7.3.9  Slope Compensation
      10. 7.3.10 Overcurrent Protection
        1. 7.3.10.1 High-Side MOSFET Overcurrent Protection
        2. 7.3.10.2 Low-Side MOSFET Overcurrent Protection
      11. 7.3.11 Power Good
        1. 7.3.11.1 Adjustable Switching Frequency
      12. 7.3.12 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Serial Interface Description
      2. 7.4.2 I2C Update Sequence
    5. 7.5 Register Maps
      1. 7.5.1 VOUT2_SEL: Vout2 Voltage Selection Register (Address = 0x01H)
      2. 7.5.2 VOUT1_COM: Buck1 Command Register (offset = 0x03H)
      3. 7.5.3 VOUT2_COM: Buck2 Command Register (offset = 0x04H)
      4. 7.5.4 VOUT3_COM: Buck3 Command Register (offset = 0x05H)
      5. 7.5.5 SYS_STATUS: System Status Register (offset = 0x06H)
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Inductor Selection
        2. 8.2.2.2 Output Capacitor Selection
        3. 8.2.2.3 Input Capacitor Selection
        4. 8.2.2.4 Loop Compensation
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision C (November 2015) to Revision D (May 2023)

  • 在数据表标题中添加了“汽车”一词Go
  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • 通篇去除了图像的颜色Go
  • Change description of V7V pin in Table 5-1 Go
  • Update the ESD table to be in accordance with automotive specification.Go
  • Changed the recommended value of capacitor from V7V pin to power ground in V7V Low-Dropout Regulator and Bootstrap .Go
  • Changed all instances of legacy terminology to controller and target where I2C is mentioned.Go
  • Changed recommended value of C9 in Figure 8-1.Go

Changes from Revision B (January 2015) to Revision C (November 2015)

  • Added more pin information for SDA and SCL Go
  • Added more information about SDA and SCL pins Go
  • Added Community Resources Go

Changes from Revision A (January 2015) to Revision B (January 2015)

  • 已将器件状态更新为量产数据Go

Changes from Revision * (December 2014) to Revision A (January 2015)

  • 将特性 中的反馈基准电压从 0.6V ±2% 更改为 0.6V ±1%Go
  • Updated values for feedback voltage, PGOOD pin leakage, V7V LDO output voltage, buck1 low-side sink current limit, and buck2/buck3 low-side sink current limit in Electrical Characteristics Go
  • Updated current value in Section 7.3.8 , Equation 6, and Figure 7-10 Go