ZHCS462A July   2011  – August 2015 TPS65186

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: Data Transmission
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Wake-Up and Power-Up Sequencing
      2. 8.3.2  Dependencies Between Rails
      3. 8.3.3  Soft Start
      4. 8.3.4  VPOS/VNEG Supply Tracking
      5. 8.3.5  V3P3 Power Switch
      6. 8.3.6  VCOM Adjustment
        1. 8.3.6.1 Kick-Back Voltage Measurement
        2. 8.3.6.2 Storing the VCOM Power-Up Default Value in Memory
      7. 8.3.7  Fault Handling and Recovery
      8. 8.3.8  Power Good Pin
      9. 8.3.9  Interrupt Pin
      10. 8.3.10 Panel Temperature Monitoring
        1. 8.3.10.1 NTC Bias Circuit
        2. 8.3.10.2 Hot, Cold, and Temperature-Change Interrupts
        3. 8.3.10.3 Typical Application of the Temperature Monitor
    4. 8.4 Device Functional Modes
      1. 8.4.1 SLEEP
      2. 8.4.2 STANDBY
      3. 8.4.3 ACTIVE
      4. 8.4.4 Mode Transitions
        1. 8.4.4.1 SLEEP → ACTIVE
        2. 8.4.4.2 SLEEP → STANDBY
        3. 8.4.4.3 STANDBY → ACTIVE
        4. 8.4.4.4 ACTIVE → STANDBY
        5. 8.4.4.5 STANDBY → SLEEP
        6. 8.4.4.6 ACTIVE → SLEEP
    5. 8.5 Programming
      1. 8.5.1 I2C Bus Operation
    6. 8.6 Register Maps
      1. 8.6.1  Thermistor Readout (TMST_VALUE)
      2. 8.6.2  Enable (ENABLE)
      3. 8.6.3  Voltage Adjustment Register (VADJ)
      4. 8.6.4  VCOM 1 (VCOM1)
      5. 8.6.5  VCOM 2 (VCOM2)
      6. 8.6.6  Interrupt Enable 1 (INT_EN1)
      7. 8.6.7  Interrupt Enable 2 (INT_EN2)
      8. 8.6.8  Interrupt 1 (INT1)
      9. 8.6.9  Interrupt 2 (INT2)
      10. 8.6.10 Power Up Sequence Register 0 (UPSEQ0)
      11. 8.6.11 Power Up Sequence Register 1 (UPSEQ1)
      12. 8.6.12 Power Down Sequence Register 0 (DWNSEQ0)
      13. 8.6.13 Power Down Sequence Register 1 (DWNSEQ1)
      14. 8.6.14 Thermistor Register 1 (TMST1)
      15. 8.6.15 Thermistor Register 2 (TMST2)
      16. 8.6.16 Power Good Status (PG)
      17. 8.6.17 Revision and Version Control (REVID)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from * Revision (July 2011) to A Revision

  • Added ESD 额定值表，特性 描述部分，器件功能模式，应用和实施部分，电源相关建议部分，布局部分，器件和文档支持部分以及机械、封装和可订购信息部分Go
  • Changed ROUT from “TBD” to “5 Ω”Go