ZHCSJW0D June   2019  – March 2020 TPS62840

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      典型应用
      2.      效率与负载电流间的关系 (VOUT = 1.8V)
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Smart Enable and Shutdown
      2. 8.3.2 Soft Start
      3. 8.3.3 Mode Selection: Power-Save Mode (PFM/PWM) or Forced PWM Operation (FPWM)
      4. 8.3.4 Output Voltage Selection (VSET)
      5. 8.3.5 Undervoltage Lockout UVLO
      6. 8.3.6 Switch Current Limit / Short Circuit Protection
      7. 8.3.7 Output Voltage Discharge
      8. 8.3.8 Thermal Shutdown
      9. 8.3.9 STOP Mode
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Save Mode Operation
      2. 8.4.2 Forced PWM Mode Operation
      3. 8.4.3 100% Mode Operation
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
        2. 9.2.2.2 Output Capacitor Selection
        3. 9.2.2.3 Input Capacitor Selection
      3. 9.2.3 Application Curves
    3. 9.3 System Example
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 第三方产品免责声明
    2. 12.2 保障资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Layout Guidelines

The TPS62840 pinout has been optimized to enable a single layer PCB routing of the device and its critical passive components such as CIN, COUT, and L.

  • As for all switching power supplies, the layout is an important step in the design. Care must be taken in board layout to get the specified performance.
  • It is critical to provide a low inductance, low impedance ground path. Therefore, use wide and short traces for the main current paths.
  • The input capacitor must be placed as close as possible to the VIN and GND pins of the device. This is the most critical component placement.
  • The VOS line is a sensitive, high impedance line and must be connected to the output capacitor and routed away from noisy components and traces (for example, the SW line) or other noise sources.