SLVSAG8G September   2011  – June 2016 TPS61253 , TPS61254 , TPS61256 , TPS61258 , TPS61259 , TPS612592

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Options
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Current Limit Operation
      2. 9.3.2 Enable
      3. 9.3.3 Load Disconnect and Reverse Current Protection
      4. 9.3.4 Softstart
      5. 9.3.5 Undervoltage Lockout
      6. 9.3.6 Thermal Regulation
      7. 9.3.7 Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power Save Mode
      2. 9.4.2 Standby Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Inductor Selection
        2. 10.2.2.2 Output Capacitor
        3. 10.2.2.3 Input Capacitor
        4. 10.2.2.4 Checking Loop Stability
      3. 10.2.3 Application Curves
    3. 10.3 System Examples
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Package Summary
      1. 14.1.1 Package Dimensions

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • YFF|9
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from F Revision (March 2016) to G Revision

Changes from E Revision (March 2015) to F Revision

  • Added device TPS612592Go

Changes from D Revision (December 2014) to E Revision

  • Changed Body Size (NOM) from "1.60 mm × 1. 60" to "1.206 mm × 1. 306" in the Device Information table.Go
  • Added table note reference to Third-Party Products DisclaimerGo

Changes from C Revision (August 2012) to D Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo

Changes from B Revision (May 2012) to C Revision

  • Added TPS61259 to data sheet header as production device.Go
  • Changed device TPS61259 to production statusGo

Changes from A Revision (October 2011) to B Revision

  • Added TPS61253 and TPS61258 to data sheet header as production devices.Go
  • Changed devices TPS61253 and TPS61258 to production statusGo
  • Changed graphic entity for Figure 3Go
  • Changed graphic entity for Figure 10 and Figure 13Go
  • Changed graphic entity for Figure 23Go

Changes from * Revision (September 2011) to A Revision

  • Changed device TPS61256 to production statusGo